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From: "Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Date: Thu, 2 Jan 2020 15:02:26 -0500
Message-ID: <CAM7eQ1ktA=G34oWMe2-ED_u=iUOwey1Ovp7B3sosoH0fF3J+nw@mail.gmail.com>
Subject: Re: [geda-user] Home soldering LGA-12 suggestions
To: geda-user AT delorie DOT com
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Yes, I used flux

On Thu, Jan 2, 2020 at 2:48 PM N (nicklas DOT karlsson17 AT gmail DOT com) [via
geda-user AT delorie DOT com] <geda-user AT delorie DOT com> wrote:

> You use solder flux?
>
> > I'm using a 2-axis gyro chip in a design and the largest package pith I
> can
> > find is 0.5mm pitch.
> >
> > I have a solder paste dispenser along with a hot air setup.  The problem
> > I'm having is that the solder dispenser puts out too much paste on the
> > shortest time pulse setting.  My footprint has extended pads in the hope
> of
> > solder prepping the pads, place the chip then going around the outer pads
> > to reflow the solder (with the smallest soldering iron tip) but it is so
> > small and the chip is just not sticking.
> >
> > Any suggestions?
>

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<div dir=3D"ltr">Yes, I used flux</div><br><div class=3D"gmail_quote"><div =
dir=3D"ltr" class=3D"gmail_attr">On Thu, Jan 2, 2020 at 2:48 PM N (<a href=
=3D"mailto:nicklas DOT karlsson17 AT gmail DOT com">nicklas DOT karlsson17 AT gmail DOT com</a>) =
[via <a href=3D"mailto:geda-user AT delorie DOT com">geda-user AT delorie DOT com</a>] &l=
t;<a href=3D"mailto:geda-user AT delorie DOT com">geda-user AT delorie DOT com</a>&gt; wr=
ote:<br></div><blockquote class=3D"gmail_quote" style=3D"margin:0px 0px 0px=
 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">You use sol=
der flux?<br>
<br>
&gt; I&#39;m using a 2-axis gyro chip in a design and the largest package p=
ith I can<br>
&gt; find is 0.5mm pitch.<br>
&gt; <br>
&gt; I have a solder paste dispenser along with a hot air setup.=C2=A0 The =
problem<br>
&gt; I&#39;m having is that the solder dispenser puts out too much paste on=
 the<br>
&gt; shortest time pulse setting.=C2=A0 My footprint has extended pads in t=
he hope of<br>
&gt; solder prepping the pads, place the chip then going around the outer p=
ads<br>
&gt; to reflow the solder (with the smallest soldering iron tip) but it is =
so<br>
&gt; small and the chip is just not sticking.<br>
&gt; <br>
&gt; Any suggestions?<br>
</blockquote></div>

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