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Subject: Re: [geda-user] Home soldering LGA-12 suggestions
To: geda-user AT delorie DOT com
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From: "David W. Schultz (david DOT schultz AT earthlink DOT net) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Date: Thu, 2 Jan 2020 13:37:27 -0600
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On 1/2/20 12:02 PM, Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via
geda-user AT delorie DOT com] wrote:
> I'm using a 2-axis gyro chip in a design and the largest package pith I
> can find is 0.5mm pitch.
> 
> I have a solder paste dispenser along with a hot air setup.  The problem
> I'm having is that the solder dispenser puts out too much paste on the
> shortest time pulse setting.  My footprint has extended pads in the hope
> of solder prepping the pads, place the chip then going around the
> outer pads to reflow the solder (with the smallest soldering iron tip)
> but it is so small and the chip is just not sticking.
> 
> Any suggestions?

I have tried a stencil with this sort of thing with mixed results. The
biggest problem I have is placing the part since it is impossible to
line up the part and pads. I have taken to adding alignment marks to the
silk layer to aid in placement.

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