X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=date:from:to:subject:message-id:in-reply-to:references:mime-version :content-transfer-encoding; bh=bdJaYYnLbsv84quI+SqlE3emvRcejfKtElF5A84gBuY=; b=OB8SeReLlCtHcCNZhVcX6jUmtJcO1bMLOk/QKC0Rsnfo817UKvkmaf5g7Ti44t/DP5 MNfj3q99rIh6IAIsMSwMXMMcT4B/wuy3Tb24kMqrvVOgt5LmjLg/yh463vSaTSUuw+cR f7/KuPvG6LDLNLH8AY1PR3Gmkp73pypGyTvfrTp2JZ+cGI3+XrWu+3RN8WNzLah0lV4E ob8h1rJ4whJrDhtK+R3lRQZfoIucTEC4DEKJlY9JeL6BHZqZjzFmMq+BHXhX6uQJR/v2 hYVIiZhVkcj41AD21atbxm7ZAfILDl/psDuv3PSDemYwkJh9GC6OA7b9c0+2opce5Pwi lxQw== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:date:from:to:subject:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=bdJaYYnLbsv84quI+SqlE3emvRcejfKtElF5A84gBuY=; b=n+1QPQviXRy+gsrgruwt1kVIoTv/rkeQKccgGoFgb32tSaCAloHnBf3kz6g/7+GK1U zlHouPVT2/NqTjL1x6Sg/AQjMoAGGYTK5x5xL3MQGSbxquQ3lM5v8PREPDwLvMDlea/C 3/ZNzM6iFzFSygcs+L2+rUlu3vw588ElJbpMs/uFDMtvQ4+Ih6NFDOw1p9b43WEeIgPG GfrkDZzKhlqM/ZxZaij4qwdNV9eAp0zZ8zad3RDyNllHXcrU1TJZnRB1VjUeY8fgOoVf yrynPzd9KzMxW3h28buVM0hxKw9Kxtb1fokerUa4r8HBo3EE0CN2G7s4e+oSuGKPsXA0 MSHQ== X-Gm-Message-State: APjAAAV/mBuxPKPKMFG/OIW2SXxVZExOH82h6spiHGbwHoVVo8MVc9KN dMCSRMD+I+OTZp2BkKAj3minGGuD X-Google-Smtp-Source: APXvYqy2iIX3aTmWU/v1o56ZSybEgxpVKIDqTATQ00oXWuT900Bt0khSDSd8hJ0jOaKjljsF4yplpQ== X-Received: by 2002:a2e:93c9:: with SMTP id p9mr49393978ljh.136.1577992257241; Thu, 02 Jan 2020 11:10:57 -0800 (PST) Date: Thu, 2 Jan 2020 20:10:54 +0100 From: "N (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" To: geda-user AT delorie DOT com Subject: Re: [geda-user] Home soldering LGA-12 suggestions Message-Id: <20200102201054.f43d1cba4af49e5830a8d4dd@gmail.com> In-Reply-To: References: X-Mailer: Sylpheed 3.7.0 (GTK+ 2.24.32; x86_64-pc-linux-gnu) Mime-Version: 1.0 Content-Type: text/plain; charset=US-ASCII Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk You use solder flux? > I'm using a 2-axis gyro chip in a design and the largest package pith I can > find is 0.5mm pitch. > > I have a solder paste dispenser along with a hot air setup. The problem > I'm having is that the solder dispenser puts out too much paste on the > shortest time pulse setting. My footprint has extended pads in the hope of > solder prepping the pads, place the chip then going around the outer pads > to reflow the solder (with the smallest soldering iron tip) but it is so > small and the chip is just not sticking. > > Any suggestions?