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From: "Rob Butts (r DOT butts DOT geda AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Date: Thu, 2 Jan 2020 13:02:45 -0500
Message-ID: <CAM7eQ1n51EYFBiRTcTMDKvx19REkJiFb_Jr00LkbAkfGq6BqfA@mail.gmail.com>
Subject: [geda-user] Home soldering LGA-12 suggestions
To: geda-user AT delorie DOT com
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Reply-To: geda-user AT delorie DOT com

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I'm using a 2-axis gyro chip in a design and the largest package pith I can
find is 0.5mm pitch.

I have a solder paste dispenser along with a hot air setup.  The problem
I'm having is that the solder dispenser puts out too much paste on the
shortest time pulse setting.  My footprint has extended pads in the hope of
solder prepping the pads, place the chip then going around the outer pads
to reflow the solder (with the smallest soldering iron tip) but it is so
small and the chip is just not sticking.

Any suggestions?

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<div dir=3D"ltr">I&#39;m using a 2-axis gyro chip in a design and the large=
st package pith I can find is 0.5mm pitch.<div><br></div><div>I have a sold=
er=C2=A0paste dispenser along with a hot air setup.=C2=A0 The problem I&#39=
;m having is that the solder dispenser puts out too much paste on the short=
est time pulse setting.=C2=A0 My footprint has extended pads in the hope of=
 solder prepping the pads, place the chip then going around the outer=C2=A0=
pads to reflow the solder (with the smallest soldering iron tip) but it is =
so small and the chip is just not sticking.</div><div><br></div><div>Any su=
ggestions?</div></div>

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