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Subject: Re: [geda-user] Modify SMD stencil aperture size to prevent short
 circuits?
References: <999a6a2b-c727-4f22-3aaf-b6c20cf15807 AT linetec DOT nl>
From: "John Griessen (john AT ecosensory DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Message-ID: <0d60552c-2553-89eb-c850-26686508acdb@ecosensory.com>
Date: Thu, 21 Mar 2019 20:39:19 +0000 (UTC)
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On 3/21/19 6:01 AM, Richard Rasker (rasker AT linetec DOT nl) [via geda-user AT delorie DOT com] wrote:
> After some searching, I found that decreasing the size of the openings in the stencil and thus the amount of solder paste ending 
> up on the PCB appears to be a common way to prevent shorts of this nature.
> 
> Can anyone confirm that this is indeed a good idea? It


Yes, I do that, and for QFNs hand prototyped, I get shorts and sometimes have to reflow them, mash down, wiggle
and recenter while flowing.  Less paste is needed to avoid this shorting.   I make custom paste layers associated with footprints 
with pcb-rnd.