X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Mon, 30 Apr 2018 19:13:20 +0200 (CEST) X-X-Sender: igor2 AT igor2priv To: "michalwd1979 (michalwd1979 AT o2 DOT pl) [via geda-user AT delorie DOT com]" X-Debug: to=geda-user AT delorie DOT com from="gedau AT igor2 DOT repo DOT hu" From: gedau AT igor2 DOT repo DOT hu Subject: Re: [geda-user] Opengl PCB and mainline PCB - pcb-rnd aspects In-Reply-To: Message-ID: References: <647dca2ad89a4415ad980da6e5cdc701 AT grupawp DOT pl> User-Agent: Alpine 2.00 (DEB 1167 2008-08-23) MIME-Version: 1.0 Content-Type: TEXT/PLAIN; charset=US-ASCII; format=flowed Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk Hello Michael, On Mon, 30 Apr 2018, michalwd1979 (michalwd1979 AT o2 DOT pl) [via geda-user AT delorie DOT com] wrote: >rendering. Some time ago I've tried to check if it is possible to >incorporate opengl code to pcb-rnd, but it turns out that it is out of my >reach. We have a working opengl HID in pcb-rnd for more than a year by now. If you mean incorporating more of Peter's 3d related patches: in pcb-rnd we want to have a 2.5d editor, not a 3d editor, so the 3d parts shouldn't be merged. Instead we have an openscad export plugin that lets openscad do very nice 3d renders. Btw, merging anything forth and back between pcb-rnd and mainline became hard lately, beause around summer 2016 I decided to change project direction and really go and fix our decade old bugs and desing problems, see below. This obviously made the code diverge a lot. >By the way I was comparing both versions and I found some differences (not >sure if this is planned or not). With Peters openGL version I can draw >tracks on soldermask layer (create holes in soldermask), while with mainline >pcb it is impossible. In pcb-rnd we went on cleaning up the code and replaced most of the data model during the past ~1 year. Thus we also have editable soldermask layer -- but not as a patch or fix, but as a natural consequence of the new data model that doesn't have special cases for the mask layer. And it's not in a branch, but in production code, already tested on a number of fabbed boards, thanks to our users. (The data model redesign solved a lot of our decade old problems the same way, without adding more kludges on the existing kludges. We have editable paste layer too, and footprints can contain any of those edits: any object on any layer, including text on mask, polygon on paste or arc on outline. Plus anything can become a "pad" and thermal works on any shape - you don't need to draw tiny lines manually to connect your smd pads to polygons any more. And polygons can clear other polygons so you don't need to cheat with thick lines to draw a PSU. Oh, almost forgot: we have padstacks, which can be used as pins or pads or vias, and offer arbitrary convex polygon shapes, don't force you to have the same pad shape on all layers. And padstacks support blind/buried vias.) Regards, Igor2