X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Mon, 27 Nov 2017 05:46:20 +0100 (CET) X-X-Sender: igor2 AT igor2priv To: geda-user AT delorie DOT com X-Debug: to=geda-user AT delorie DOT com from="gedau AT igor2 DOT repo DOT hu" From: gedau AT igor2 DOT repo DOT hu Subject: [geda-user] [pcb-rnd] thermal on smd pads - video Message-ID: User-Agent: Alpine 2.00 (DEB 1167 2008-08-23) MIME-Version: 1.0 Content-Type: TEXT/PLAIN; format=flowed; charset=US-ASCII Reply-To: geda-user AT delorie DOT com Hi all, a long standing user request is to have thermals on SMD pads, mentioned e.g. in these 13 and 9 years old threads: http://archives.seul.org/geda/user/Aug-2004/msg00118.html http://archives.seul.org/geda/user/Jul-2008/msg00411.html In pcb-rnd we make things happen. This week's minute video demonstrates how to do this with pcb-rnd, using padstacks and a subcircuit: https://archive.org/details/pcb-rnd-pad-thermal It starts with 3 pad stacks and 2 silk lines converted into a subcircuit, terminal names ("pin numbers") assigned to the SMD pads. These steps are similar to how we used to build elements. Then from 00:30 the thermal tool is used to toggle thermals on each padstack. The generic polygon shaped padstack is in the video to demonstrate that we are free from special casing and hacks: the rectangular pad is really a rectangular polygon, not a square cap line, and everything (including the thermal tool) works on every object type. Regards, Igor2