X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Sun, 13 Aug 2017 14:53:57 +0200 (CEST) X-X-Sender: igor2 AT igor2priv To: geda-user AT delorie DOT com X-Debug: to=geda-user AT delorie DOT com from="gedau AT igor2 DOT repo DOT hu" From: gedau AT igor2 DOT repo DOT hu Subject: Re: [geda-user] pcb slotted holes for relay In-Reply-To: Message-ID: References: <15585a1f-79e3-3aa2-3f9e-239365b53bed AT ecosensory DOT com> User-Agent: Alpine 2.00 (DEB 1167 2008-08-23) MIME-Version: 1.0 Content-Type: TEXT/PLAIN; format=flowed; charset=US-ASCII Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Sun, 13 Aug 2017, Carlos Nieves wrote: > I don't think this is the right way... Specially for plated holes. Fabs usually check that there is a distance between copper and the board outline, so copper is not exposed at edges. > Doing it that way will results in failing that drc and having to postprocess the outline file... Well, the complete final solution would one of these: Option A: 1. you define two layers groups, both with type "outline" so that pcb-rnd understands they are milled with a router; one of them is the real outline layer and unplated slots, the other is the plated slots [this is not yet possible, pcb-rnd assumes there's only one outline layer; not terribly hard to fix] 2. the slot layer needs to be marked as 'plated' so all objects drawn there behave like vias, connecting layers [not yet possible; somewhat harder to do, but still on the relatively easy side] 3. implement your footprint as a subcircuit, draw your slot as a line on the 'slot' layer; this will result in a plated slot; you may want to add some copper lines/polys around it on the top and bottom sides [this is already possible since release 1.2.4] 4. tag the slot and the top/bottom copper lines/polys to the same terminal ("pin number") so the netlist understands the connection [I'm working on this these days, will be possible in 1..2 weeks] 5. on export you simply get a normal unplated outline layer and a plated slot layer separately; you can then name the files accordingly or tell the fab house and I am sure they will understand not to run the copper-distance DRC on the slots [this step, exporting multiple outline layers, is already possible, if an export naming style is selected that doesn't result in overwriting the same file twice] Option B: after the subcircuit upgrade, next target will be pad stacks. I am tempted to introduce "hole shapes": for a common via or pin you'd use a circular hole (drill) but it would also allow lines for slots. This way the resulting construct is like a via (pin) in all regards. According to my current plans I will probably start coding pad stacks this year; having non-circular hole is a smallish task compared to the rest pad stacks need, so it's rather probable that we have this. In this setup the slots would end up in the plated drill file, much like your example showed. Note: eventually both methods will be available. The only question is when, which also depends on how much pull they get from active pcb-rnd users. At the moment pad stack seems to be the one that would be implemented first. Regards, Igor2