X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:in-reply-to:references:from:date:message-id:subject:to; bh=0wkDIL7WnqefEjhIuUSvULab6HXJtKCStpDdodGDYss=; b=pZPoj2HuzZktsAKsmJQz0C/Mwf9bfHamlZcJr+DwJWJgrtrEOeO/NUtY6T9mss0Bbt tXxqCgT4ESEfXl922Ap01uCS6ywAM9vLi48C589a53xuOeelo1farLCfTtxZnsEPLUs3 J68GS3/aYMEkx88qWnepvHWAUyHwo/flHHzvqTZ81PiYT6ABkeAQUN9gVukubU3HEfr7 GKV4+dXG27NFUJ+Q7p21MFucGcIpmpKFqXP7Aou6U9rcaoVoRreYMxuelS2zOmIIeajk e7TlSRHhNuOOW6XBUBnDOIFZohmAVB4lYstBxUsA8cr4h8aMIVqEeYWHlQa+glGEoM9C xEbQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:mime-version:in-reply-to:references:from:date :message-id:subject:to; bh=0wkDIL7WnqefEjhIuUSvULab6HXJtKCStpDdodGDYss=; b=cCiQshsCu2ONbEj4FY9vCXiObtKy6qfglkqvpiqWd4ul4oA99tUo8M6uTQsoew/zmT YtmiFGHSJ9CUNcJwaUwM9I5f7Ai8ZeA7ZOAJzWH7X792Kb/0W+OJEooxGm0oNdoAJOkK OJEH4tZ/7AVg/1T4t8IFF6Y4ono3os1qa4y4inUcCk7VnWBmnNPf0V6zMkCR2kShps9t OfNQdzIXEOVo0MNAHEG+B9kV83IP7FHeQmqpGqmWdyT+cg1HbXKAD9VnIfw2YKIgCgvF UUh0RI8lxDxeRlOh3fdq21Sd9rdUXOH11KPgxTcixbOUX/2Ve0ErP/QOqxiPUyz4wgmj OHVw== X-Gm-Message-State: AFeK/H1BM6OMUNBRyFgzKe/DDo2to57qwiaPvIbh10Cx+W0Grp1SkAckakd6USbmrlQidm5I9PnXd3/c3WIyoQ== X-Received: by 10.46.7.66 with SMTP id i2mr2910177ljd.51.1491066751006; Sat, 01 Apr 2017 10:12:31 -0700 (PDT) MIME-Version: 1.0 In-Reply-To: References: <20170327154129 DOT 68029809DB6C AT turkos DOT aspodata DOT se> <20170328132437 DOT 46A6B809DB6C AT turkos DOT aspodata DOT se> <20170329182946 DOT ae2033e7ec476c9f1ddd35f3 AT gmail DOT com> <20170330182655 DOT 91a8f3e1f328bd0becb1ca3f AT gmail DOT com> From: "John Luciani (jluciani AT gmail DOT com) [via geda-user AT delorie DOT com]" Date: Sat, 1 Apr 2017 13:12:30 -0400 Message-ID: Subject: Re: [geda-user] No support for solder paste in pcb file format ? To: geda-user AT delorie DOT com Content-Type: multipart/alternative; boundary=f403045f74b807bddb054c1e08dd Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --f403045f74b807bddb054c1e08dd Content-Type: text/plain; charset=UTF-8 On Fri, Mar 31, 2017 at 10:40 AM, Nicklas Karlsson ( nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] < geda-user AT delorie DOT com> wrote: > I used other software before and there it was possible to draw in paste > layer but I also heard files where modified before production. It is more a > question about if paste layer is bettery generated from a template like > clearance is around objects or by manually adding objects to the layer? > I would not manually add any objects. When you run a command or script to generate a paste layer (or export a stencil) I would look at each footprint. If the footprint has an sfp file use it. If not then automatically generate a pattern with a set of rules. John L > > 2017-03-31 1:50 GMT+02:00 John Luciani (jluciani AT gmail DOT com) [via > geda-user AT delorie DOT com] : > >> >> >> On Thu, Mar 30, 2017 at 12:26 PM, Nicklas Karlsson ( >> nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] < >> geda-user AT delorie DOT com> wrote: >> >>> > > > > >> John Luciani: >>> > > > > >> > I create stencil footprints with the same basename as >>> > > > > >> > the component footprint and a ".sfp" extension. I have >>> > > > > >> > a script that parses the pcb and identifies all components >>> > > > > >> > that have a stencil footprint. >>> > > > > >>> > > > > I couldn't find this script on your page. Could you please post >>> or >>> > > link? >>> > > > > >>> > > > >>> > > > The script isn't quite ready for prime-time. >>> > > >>> > > But you tell why these scipts are good? >>> > > >>> > > >>> > The current script identifies the footprints that should be changed >>> when >>> > generating gerbers for a stencil. The completed script will perform the >>> > replacement. >>> >>> To put it another way. Is it better to generate paste layer from a >>> script than manually editing each footprint? >>> >> >> I do not manually edit anything. If a part requires a stencil footprint it >> is generated with a script along with the footprint. >> >> For the other parts I do not bother. Future versions of the script will >> accommodate parts >> without sfp files by generating slightly reduced stencil openings for >> each pad. >> >> >>> >>> > > > > >> as thin line silk for checking or write the pads to the sfp >>> file. >>> > > > > >> >>> > > > > >> Do you have any specific file format for your sfp files ? >>> > > > > >> >>> > > > > > >>> > > > > > I just make them as normal footprints. For example - the >>> stencil >>> > > > > footprint >>> > > > > > below is for a Cree XP-G LED -- >>> > > > > > >>> > > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0] >>> > > > > > ( >>> > > > > > Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100] >>> > > > > > Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100] >>> > > > > > Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100] >>> > > > > > Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100] >>> > > > > > Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100] >>> > > > > > ElementLine[7996 -2484 7996 -7996 1000] >>> > > > > > ElementLine[7996 -7996 -7996 -7996 1000] >>> > > > > > ElementLine[-7996 -7996 -7996 -2484 1000] >>> > > > > > ElementLine[7996 2484 7996 7996 1000] >>> > > > > > ElementLine[7996 7996 -7996 7996 1000] >>> > > > > > ElementLine[-7996 7996 -7996 2484 1000] >>> > > > > > ElementArc[-7996 -10496 500 500 0 360 1000] >>> > > > > > ) >>> > > >>> > > The *.sfp files are used to define shapes for solder paste? >>> > > >>> > >>> > The shapes define openings in a stencil. >>> >>> Then the shapes end up on the "stencil" layer, I think "paste" layer is >>> a common name for this layer. >>> >>> >>> > > > For thermal pads I always use the grid. I have seen a lot of >>> production >>> > > > problems. Bridging and misalignments. On these large pads I use a >>> grid >>> > > > which reduces the coverage to between 50 - 60%. >>> > > >>> > > You use a grid because there will be production problems for a solid >>> shape? >>> > > >>> > >>> > Yes. I have seen bridging and misalignments. All of the components that >>> > I have used (with thermal pads) have recommended stencil openings >>> > as well as footprints. I either follow the datasheet recommendation or >>> > the manufacturer application notes. >>> >>> I do not perfectly understand this, do you have an example for example >>> datasheet or application note? >>> >> >> >> The datasheet for the Cree XPG is at >> >> www.cree.com/led-components/media/documents/XLampXPG-15B.pdf >> >> Near the end of the file are the footprint and stencil >> recommendations. >> >> >> >>> >>> >>> Regards Nicklas Karlsson >>> >> >> >> >> -- >> http://www.wiblocks.com >> > > -- http://www.wiblocks.com --f403045f74b807bddb054c1e08dd Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable

= On Fri, Mar 31, 2017 at 10:40 AM, Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] = <geda-user AT de= lorie.com> wrote:
I used other software before and there it was possible to draw in = paste layer but I also heard files where modified before production. It is = more a question about if paste layer is bettery generated from a template l= ike clearance is around objects or by manually adding objects to the layer?=

I would not manually add any objects= .

When you run a command or script to generate a paste la= yer (or export a stencil) I would
look at each footprint. If = the footprint has an sfp file use it. If not then automatically
generat= e a pattern with a set of rules.

J= ohn L


=C2=A0

2017-03-31 1:50 GMT+02:00 John Luciani (jluciani AT gmail DOT com) [via geda-user AT delorie DOT com<= /a>] <geda-user AT delorie DOT com>:


On Thu, Mar 30, 2017 at 12:26 PM, Nicklas Karlsson (nicklas.karls= son17 AT gmail DOT com) [via geda-user AT delorie DOT com] <geda-user AT delorie DOT com><= /span> wrote:
> > > &= gt; >> John Luciani:
> > > > >> > I create stencil footprints with the same= basename as
> > > > >> > the component footprint and a ".sfp&= quot; extension. I have
> > > > >> > a script that parses the pcb and identifi= es all components
> > > > >> > that have a stencil footprint.
> > > >
> > > > I couldn't find this script on your page.=C2=A0 Cou= ld you please post or
> > link?
> > > >
> > >
> > > The script isn't quite ready for prime-time.
> >
> > But you tell why these scipts are good?
> >
> >
> The current script identifies the footprints that should be changed wh= en
> generating gerbers for a stencil. The completed script will perform th= e
> replacement.

To put it another way. Is it better to generate paste layer from a s= cript than manually editing each footprint?

=
I do not manually edit anything. If a part requires a stencil f= ootprint it
is generated with a script along with the footpri= nt.

For the other parts I do not bother. Future versions = of the script will accommodate parts
without sfp files by generating sli= ghtly reduced stencil openings for each pad.



> > > > >> as thin line silk for checking or write the pa= ds to the sfp file.
> > > > >>
> > > > >> Do you have any specific file format for your = sfp files ?
> > > > >>
> > > > >
> > > > > I just make them as normal footprints. For example= - the stencil
> > > > footprint
> > > > > below is for a Cree XP-G LED --
> > > > >
> > > > > Element[0x0 "LED" "" "&qu= ot; 0 0 9996 2996 0 100 0x0]
> > > > > (
> > > > >=C2=A0 =C2=A0 Pad[-5511 -5511 -5511 5511 1968 2000 = 2968 "" "1" 0x0100]
> > > > >=C2=A0 =C2=A0 Pad[5511 -5511 5511 5511 1968 2000 29= 68 "" "2" 0x0100]
> > > > >=C2=A0 =C2=A0 Pad[-492 -3937 492 -3937 2952 2000 39= 52 "" "3" 0x0100]
> > > > >=C2=A0 =C2=A0 Pad[-492 0 492 0 2952 2000 3952 "= ;" "3" 0x0100]
> > > > >=C2=A0 =C2=A0 Pad[-492 3937 492 3937 2952 2000 3952= "" "3" 0x0100]
> > > > >=C2=A0 =C2=A0 ElementLine[7996 -2484 7996 -7996 100= 0]
> > > > >=C2=A0 =C2=A0 ElementLine[7996 -7996 -7996 -7996 10= 00]
> > > > >=C2=A0 =C2=A0 ElementLine[-7996 -7996 -7996 -2484 1= 000]
> > > > >=C2=A0 =C2=A0 ElementLine[7996 2484 7996 7996 1000]=
> > > > >=C2=A0 =C2=A0 ElementLine[7996 7996 -7996 7996 1000= ]
> > > > >=C2=A0 =C2=A0 ElementLine[-7996 7996 -7996 2484 100= 0]
> > > > >=C2=A0 =C2=A0 ElementArc[-7996 -10496 500 500 0 360= 1000]
> > > > > )
> >
> > The *.sfp files are used to define shapes for solder paste?
> >
>
> The shapes define openings in a stencil.

Then the shapes end up on the "stencil" layer, I think &qu= ot;paste" layer is a common name for this layer.


> > > For thermal pads I always use the grid. I have seen a lot of= production
> > > problems. Bridging and misalignments. On these large pads I = use a grid
> > > which reduces the coverage to between 50 - 60%.
> >
> > You use a grid because there will be production problems for a so= lid shape?
> >
>
> Yes. I have seen bridging and misalignments. All of the components tha= t
> I have used (with thermal pads) have recommended stencil openings
> as well as footprints. I either follow the datasheet recommendation or=
> the manufacturer application notes.

I do not perfectly understand this, do you have an example for examp= le datasheet or application note?


=
Near the end of the file are the footprint and stencil
= recommendations.

=C2=A0


Regards Nicklas Karlsson



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