X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=date:from:to:subject:message-id:in-reply-to:references:mime-version :content-transfer-encoding; bh=sTmtP6GVGHE3lg65cF+46UWzjmexwdGYI/EnuHg27+I=; b=hWCwafO80zukOYA+bwNd3Q2EAalEhycDwYAi0i9ecTErnPtB865PHXb1M0nezWl/r7 6UVkl1epK97z4zdejtFm1PW2zyy4ji/iR+WEtQBSrr39TnEZtdz3Y2/M9V2VcXynd4M5 5Gfb92nH5Qqa8Puep4wHIeDjZ8SDWV+SQnBRv1mbtRnWpL5n6+azEeHIgSnfTNg/Kq/6 nr7qo6pby09lX2jvhBlAGx7bSyvpodvD3t2zL5MNms5PkWujo6+y7o18rVHdUo647vvX YBrf0ODie9jXXAbALH1r6bxKGXP7g2ppyWGs1aCGBaSKC25s7b1TfMEaceyKAkcqmVHF 2Lrw== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:date:from:to:subject:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=sTmtP6GVGHE3lg65cF+46UWzjmexwdGYI/EnuHg27+I=; b=tyxkISVyEmh+TKgBky/79fXD1IvQt0Pu2+MuWMy+vBsjjwSH/nGwNgf4ER0/Y2o3Pj bnnDDP57QBJySOffHy4oIWDYwdkeB5D/8N1nFnyczNOjSdRYp+RRkIXfgul+1oCrHt3l T5Y+58RbmGu/8UuSOeQhfta/MHMCmIuN/pEiNoCtg+U3fAUKd3cwy/4x6lM7dQY70DnC 87fc16jg5KMgr/dC0I7iU1jweSs/RLZaQU7zG0n0y3OeTOFANU60SzRaRKzY45o/Clbh agIJ3isCtDSxvF/bTvi5oSBEO1bAESDJ6DpEeUv4YatLtj4dBT74h8A0e57zUeEtmqzW /4mw== X-Gm-Message-State: AFeK/H3bXmFo901wwerWFzJ9ax4VVZA70EtmqjEDYFcSHKb9ckV+O1IBxIxAxwSP+Ng+6g== X-Received: by 10.46.69.87 with SMTP id s84mr517767lja.69.1490804987821; Wed, 29 Mar 2017 09:29:47 -0700 (PDT) Date: Wed, 29 Mar 2017 18:29:46 +0200 From: "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" To: geda-user AT delorie DOT com Subject: Re: [geda-user] No support for solder paste in pcb file format ? Message-Id: <20170329182946.ae2033e7ec476c9f1ddd35f3@gmail.com> In-Reply-To: References: <20170327154129 DOT 68029809DB6C AT turkos DOT aspodata DOT se> <20170328132437 DOT 46A6B809DB6C AT turkos DOT aspodata DOT se> X-Mailer: Sylpheed 3.5.1 (GTK+ 2.24.31; x86_64-pc-linux-gnu) Mime-Version: 1.0 Content-Type: text/plain; charset=US-ASCII Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > > >> John Luciani: > > >> > I create stencil footprints with the same basename as > > >> > the component footprint and a ".sfp" extension. I have > > >> > a script that parses the pcb and identifies all components > > >> > that have a stencil footprint. > > > > I couldn't find this script on your page. Could you please post or link? > > > > The script isn't quite ready for prime-time. But you tell why these scipts are good? > > >> Then I could have a flag in the fp generator to either make paste pads > > >> as thin line silk for checking or write the pads to the sfp file. > > >> > > >> Do you have any specific file format for your sfp files ? > > >> > > > > > > I just make them as normal footprints. For example - the stencil > > footprint > > > below is for a Cree XP-G LED -- > > > > > > Element[0x0 "LED" "" "" 0 0 9996 2996 0 100 0x0] > > > ( > > > Pad[-5511 -5511 -5511 5511 1968 2000 2968 "" "1" 0x0100] > > > Pad[5511 -5511 5511 5511 1968 2000 2968 "" "2" 0x0100] > > > Pad[-492 -3937 492 -3937 2952 2000 3952 "" "3" 0x0100] > > > Pad[-492 0 492 0 2952 2000 3952 "" "3" 0x0100] > > > Pad[-492 3937 492 3937 2952 2000 3952 "" "3" 0x0100] > > > ElementLine[7996 -2484 7996 -7996 1000] > > > ElementLine[7996 -7996 -7996 -7996 1000] > > > ElementLine[-7996 -7996 -7996 -2484 1000] > > > ElementLine[7996 2484 7996 7996 1000] > > > ElementLine[7996 7996 -7996 7996 1000] > > > ElementLine[-7996 7996 -7996 2484 1000] > > > ElementArc[-7996 -10496 500 500 0 360 1000] > > > ) The *.sfp files are used to define shapes for solder paste? > For thermal pads I always use the grid. I have seen a lot of production > problems. Bridging and misalignments. On these large pads I use a grid > which reduces the coverage to between 50 - 60%. You use a grid because there will be production problems for a solid shape?