X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Mon, 27 Mar 2017 18:04:06 +0200 (CEST) X-X-Sender: igor2 AT igor2priv To: geda-user AT delorie DOT com X-Debug: to=geda-user AT delorie DOT com from="gedau AT igor2 DOT repo DOT hu" From: gedau AT igor2 DOT repo DOT hu Subject: Re: [geda-user] No support for solder paste in pcb file format ? In-Reply-To: <20170327154129.68029809DB6C@turkos.aspodata.se> Message-ID: References: <20170327154129 DOT 68029809DB6C AT turkos DOT aspodata DOT se> User-Agent: Alpine 2.00 (DEB 1167 2008-08-23) MIME-Version: 1.0 Content-Type: TEXT/PLAIN; charset=US-ASCII; format=flowed Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Mon, 27 Mar 2017, karl AT aspodata DOT se wrote: > Is there a way to specify openings and sizes of solder paste in pcb ? > > In e.g. > http://assets.nexperia.com/documents/outline-drawing/SOD962.pdf > http://assets.nexperia.com/documents/outline-drawing/SOT883.pdf > the pads and the solder paste are different. > Last time I checked mainline, and this is the current standing of pcb-rnd too: solder paste layer is automatically calculated from pads. There's no easy way to manipulat the paste layer directly. Indirect way of manupulation: add more SMD pads, even overlapping pads to get more paste at some spots.