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From: "Erich Heinzle (a1039181 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Date: Mon, 6 Mar 2017 09:36:35 +1030
Message-ID: <CAHUm0tMpaApEJFNj5msrx78XTm_5iMhQ7W1LORYDbUfja4tBxA@mail.gmail.com>
Subject: Re: [geda-user] Layout data for Raspberry Pi B 3.5" TFT Touch screen
To: geda-user <geda-user AT delorie DOT com>
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Precedence: bulk

I stuck the layer data into a <= 16 layer design file for you

http://users.on.net/~esh/geda/EagleToKicadToPCBRNDtft.pcb

which plays nicely with a default 16 layer PCB v1.99:

http://imgur.com/a/MEB1M

The main loss on conversion is silkscreen/refdes text
placement/justification and sizing/kerning. Features such as
footprints, pads, lines and polygons are essentially lossless, barring
polygons within footprints (unsupported by gEDa PCB/pcb-rnd).

Apertures within polygons and thermals are not fully supported on
conversion, due to peculiarities in Kicad's approach to describing the
interaction between pours and vias.

Rotation of footprints other than in 90 degree increments during
import has not been implemented at this stage.

With the rise of conversion pathways from Eagle, Kicad and Altium to
gEDA PCB/pcb-rnd, it may be worth having 32 + outline + silks as the
default layer capacity in stock builds of gEDA in the not too distant
future.

In the meantime, those building from source can alter the default
layer capacity prior to building.

Cheers,

Erich.