X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f
X-Recipient: geda-user AT delorie DOT com
X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed;
        d=gmail.com; s=20120113;
        h=subject:to:references:from:message-id:date:user-agent:mime-version
         :in-reply-to:content-transfer-encoding;
        bh=g8xc0DD04GYdtHdn5AWmr5wh8N/g3CbN4+Xbzcihsc0=;
        b=pSY+TDqfu4TPJMrH0hTEJ/XnLcfxEEBOGRS5VcaPKGuk4JJMMt9xwSpBm6DP/GO0QS
         CvZ1Q8EFT9L5fdvSp10nBlNFVt9wuv59IR8lCeYNhvHDWgpfZ29pr32fv/YIpI3AeIga
         FbNUScIzY90t1FzQbLHkGsvpe9Y+PdQTV1njo4p08zpp5Uvs9ZO8VQJ79qRI2aT2ZSn9
         rNbuGbeauCEtZzk9QZD+nA0enL6UEvVBmQ/q+XXdw1wza1ZkP5N7YDQrik5rfkJj8RIA
         ojvQHw6BHnp7k+/muasICl6n3tdyI2uoj3fhqVm/OYKiqxpv4tFN/ZBe7xwhbRVilZ8L
         Q2MA==
X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed;
        d=1e100.net; s=20130820;
        h=x-gm-message-state:subject:to:references:from:message-id:date
         :user-agent:mime-version:in-reply-to:content-transfer-encoding;
        bh=g8xc0DD04GYdtHdn5AWmr5wh8N/g3CbN4+Xbzcihsc0=;
        b=L3euTeRjd7mON6XPJol4mZhdeMRfuR2reShE2v/OuUqte6xIuRa/0WpWfB16VQfjjd
         LJCgad5ny1Q4UUUOkQmQT7XzMywlo20LT8ZfLsPNoLTZrRCofDrwgEqXvR0zErcY6B0u
         i3/MOWm4GGIHSIvahw4GH7Kqp2I4ebV6p+Rj7TCAmf4fRPVrCgZbimnx1QDCYfLLRoH8
         6EyrUHZpjhgCFArnbosZsaQAVGJqgmLawoZr5adkDsZ2aVwtNDqRRX9/C01cWcMexkDi
         KBKFlraauLA/FOCSeLmVx7zZShy3jueXErikaL1l+7Ghwr6na8x08G+gZ6shiIiO38ek
         Ywnw==
X-Gm-Message-State: ABUngvekPMcLfvEjlYTJ9TolnRRPJAWD6w5+tm9KFmuk3l4nPlc0YcmBsT/ED8sXtXv5Tg==
X-Received: by 10.99.132.194 with SMTP id k185mr13276434pgd.171.1478970018085;
        Sat, 12 Nov 2016 09:00:18 -0800 (PST)
Subject: Re: [geda-user] pcb file format
To: geda-user AT delorie DOT com
References: <0d49697a-80c7-d588-859a-56bc542f7e5d AT ecosensory DOT com>
From: "Charles Repetti (charlie94965 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Message-ID: <f54225e8-dfc4-e160-ef35-f332615eafb1@gmail.com>
Date: Sat, 12 Nov 2016 09:00:15 -0800
User-Agent: Mozilla/5.0 (Macintosh; Intel Mac OS X 10.10; rv:45.0)
 Gecko/20100101 Thunderbird/45.4.0
MIME-Version: 1.0
In-Reply-To: <0d49697a-80c7-d588-859a-56bc542f7e5d@ecosensory.com>
Content-Type: text/plain; charset=utf-8; format=flowed
Content-Transfer-Encoding: 7bit
Reply-To: geda-user AT delorie DOT com
Errors-To: nobody AT delorie DOT com
X-Mailing-List: geda-user AT delorie DOT com
X-Unsubscribes-To: listserv AT delorie DOT com
Precedence: bulk

PCB Manual:

8.8.18 Pad
Pad [rX1 rY1 rX2 rY2 Thickness Clearance Mask "Name" "Number" SFlags]

So the solder mask (paste) layer is defined per pad as "Mask", and for 
me has been the most important parameter to get right. The different 
manufacturers have different capabilities, and their DFM tools can be 
used to highlight this.

The assembler may change this parameter to suit their needs no matter 
what the customer specifies. A high-powered microscope is helpful to 
check the fillets of the assembled boards to insure the manufacturer 
does this satisfactorily.


On 11/11/16 5:23 PM, John Griessen (john AT ecosensory DOT com) [via 
geda-user AT delorie DOT com] wrote:
> Can the paste layer be generated with different shrink amount per 
> footprint, or is it a per board thing?