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From: "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Subject: Re: [geda-user] The nature of gEDA layers
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> >> You still want to model a 3D PCB accurately.  But that is not the job of
> >> the layout program and its core data structures.
> >
> > In sort of but there are two methods:
> >   1. To model as it look then manufacturing is done.
> >   2. It should be possible to deduce how it should look then manufacturing is done.
> > Then drill size and between which conductive layer hole or cut out
> > should be made it is possible to deduce a accurate 3D pcb model. Your
> > example below should do the trick together with some knowledge of
> > stack up of course.
> 
> Annotated with Attributes, a HID can visualize, edit, export a full 3D
> model of the PCB.

In particular it will be well defined where there is material or not.

> > I had time to read your example more careful and could only contribute two meaningful comments:
> >
> >> Layer{name="Top:mask", Attributes{elements="COMPONENTSIDE:mask"}}
> >
> > I think the mask and silkscreen if there is one should be referenced
> > to TOP conductive layer instead of COMPONENTSIDE. Reason is multi
> > layer above two layer circuit boards are etched before they are
> > assembled and if mask/silk is referenced to conductive layer file
> > format would allow for embedded component soldered on inner layer
> > before board assembled.
> 
> This is a library layer naming convention detail.

For a surface mount element/footprint there is usually: copper, solder resist and silk screen. It would also be possible vith vias in pard or cut out above to mark size of component.

It is not to uncommon to place element on backside which work great today. Then it come to syntax of file format it should however allow to place on any layer up or down. It should work if componentside is "local" local for this element which it must be anyway. Then placing element/footprint syntax much however be such that it could be placed on any layer up or down, then there may of cours be practical limitations.

> If you select the thermal tool and click on an object, the tool will
> search for objects on the active Layer inside, with thermal=""
> Attributes, figure out what style is currently implemented, remove all
> that, look for a clearance attribute on the pad.  And then figure out
> how to replace those objects with something else, properly marked as
> thermal.  If there is nothing, it may add a clearance, for example. If
> it is not a Group, it may wrap the pad in a Group, after confirmation.

If file format allow adjustment, not a local copy without update possibility thermal currently implemented sound great! Sometimes it is useful rotate thermal. Tolerances as currently implemented are probably good in general which in sort of it is now for minimum copper spacing.