X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Virus-Status: Clean X-Virus-Scanned: clamav-milter 0.98.4 at av02.lsn.net Subject: [geda-user] What data models does gEDA have? (was: XML ) To: geda-user AT delorie DOT com References: <20151220120219 DOT c4644eef1a65b0eb2fb60d76 AT gmail DOT com> <20151220122659 DOT 378AF809D791 AT turkos DOT aspodata DOT se> <20151220120219 DOT c4644eef1a65b0eb2fb60d76 AT gmail DOT com> <20151220125839 DOT 10228 DOT qmail AT stuge DOT se> From: John Griessen Message-ID: <5676BFF0.9020707@ecosensory.com> Date: Sun, 20 Dec 2015 08:49:20 -0600 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:38.0) Gecko/20100101 Icedove/38.4.0 MIME-Version: 1.0 In-Reply-To: <20151220125839.10228.qmail@stuge.se> Content-Type: text/plain; charset=windows-1252; format=flowed Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On 12/20/2015 06:58 AM, Peter Stuge (peter AT stuge DOT se) [via geda-user AT delorie DOT com] wrote: > To the point: What data models does gEDA have? There are several. 2D physical as top: PCB: overlapping of layer pieces matches against netname netlist during DRCs. gschem: net segments without netnames become part of a net when they touch. Netlist as top: PCB: netnames make a connection netlist against which is matched the DRC physical connectivity gschem: netnames create connections by attribs attached to nets. ======================not in geda yet======================== 3D physical as top: overlapping and vertical proximity create connection. Pure physical model of via stack. Includes physical material properties model (insulating or conductive or resistive or semiconducting) for "component" creation. Use this for netlisting and DRCs. Use this as basis for buried vias, buried resistive elements, buried parallel plate capacitors, buried dielectric material zones, buried or surface contact materials, surface contact plating specs, stacked component netlisting, forward and back annotation. 3D physical is mostly a layout/fabbing design data, but some hints about bits can go in schematics as attribs. For instance, stacked components being colocated, a component being "layed out" in place rather than placed, which middle layers that wires go on for shielding purposes...