X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=date:from:to:subject:message-id:in-reply-to:references:mime-version :content-type:content-transfer-encoding; bh=gge9c8BePUHKlQUTuDMtn2q3p4IrQIx2XR2OdMr3xGQ=; b=vGXgkr2NXHDjkaVRV+rtttpTOMT5w/EZhJ3frPTaWkci4+Z8a9BcXGu7rAqnxBtvSZ SKbxBRrd8rXwmTSZrGFlA5bOJyOOp2jEwd4HDPJVN4ZDXvqvZs4q94+E17u+n5KSXPEJ oYO1VqSPcD58KfgVK8VK63J3jjfS1QTXntbMbles354JX/R4iPuhnE5AVQsDwyWN61K4 IsjNul/v7bBj8GUtf66lNse6tsIl9wqksY/Y4IHRuU+UKnTof9IHLhZSYmTn416sQGG1 WE+qmXbUuEQFujqLrZ8P4asAGoah32mJSTWwqYy/cqTtGzFyQB9v1wkNXDfcbaUs3idG sAfA== X-Received: by 10.180.23.71 with SMTP id k7mr14239917wif.11.1441955627765; Fri, 11 Sep 2015 00:13:47 -0700 (PDT) Date: Fri, 11 Sep 2015 09:13:42 +0200 From: "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" To: geda-user AT delorie DOT com Subject: Re: [geda-user] 5630 LED footprint Message-Id: <20150911091342.671ed428d34b6f4e3f84c3a4@gmail.com> In-Reply-To: References: <20150910201416 DOT GG16766 AT fi DOT muni DOT cz> <20150910234211 DOT e718beb2aa1655d22382c8a6 AT gmail DOT com> X-Mailer: Sylpheed 3.5.0beta1 (GTK+ 2.24.25; x86_64-pc-linux-gnu) Mime-Version: 1.0 Content-Type: text/plain; charset=US-ASCII Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > On Thu, Sep 10, 2015 at 9:42 PM, Nicklas Karlsson > (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com] > wrote: > >> In addition to that, I would like to modify the footprint for hand soldering, > >> i.e. the middle thermal pad should have a hole in it, connected to a > >> large pad on the opposite side of the PCB. The hole and the pad would > >> then serve as a heat sink. > > > > Usually thermal relief is added to ease hand soldering but it will also make it a very bad heat sink. I guess you have to chose between either hand soldering or heat sink. > > Nicklas : That would defeat the point of using holes (vias really) and > pads to heat sink the LED. > > What you want to do is have tons of vias and peel back the mask to > expose more copper to remove the most heat possible. To solder the > part pre-heat the board ether in an oven or with a heatgun. > You are right about the heat removal. For easy soldering thermal releif is added to reduce heat removal which of course make it worthless as a heat sink.