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Date: Mon, 20 Jul 2015 07:52:43 -0700
From: "Yvette S. Hirth, CCP, CDP (yvette AT dbtgroup DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
Organization: The DBT Group, Inc.
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To: geda-user AT delorie DOT com
Subject: Re: [geda-user] pcb-rnd: parametric footprints (status update)
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Reply-To: geda-user AT delorie DOT com

On 07/19/2015 11:45 AM, DJ Delorie wrote:
>>   > Dual in line packages with up to 22 100 mil spaced pins and 300 mil
>>     row spacing are called DIPn.
>>   > Dual in line packages with 24 or more 100 mil spaced pins and 300 mil
>>     row spacing are called DIPnN.
>>   > Dual in line packages with 100 mil spaced pins and 400 mil row
>>     spacing are called DIPnH.
>>   > Dual in line packages with 24 or more 100 mil spaced pins and 600 mil
>>     row spacing are called DIPn.
>>   > Shrink dual in line packages with up to 24 70 mil spaced pins and 300
>>     mil row spacing are called SDIPn.
>>   > Shrink dual in line packages with more than 24 70 mil spaced pins and
>>     400 mil row spacing are called SDIPn.
>>
>> so "DIPn" refers to inline packages that have both 300mil row spacing
>> and 600mil row spacing, and "SDIPn" refers to inline packages with
>> 300mil row spacing and 400mil row spacing.
>
> SDIPs are 0.070" pitch, DIPs are 0.100" pitch
>
> Standard DIPs are 0.300" row spacing up to 22 pins, and 0.600" row
> spacing above that.  The N suffix changes the 0.600" to 0.300".  The H
> suffix changes 0.300" or 0.600" to 0.400"
>
> Note that this is an industry standard, not something we made up.
>
thank you for letting me know!

yvette