X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-TCPREMOTEIP: 207.224.51.38 X-Authenticated-UID: jpd AT noqsi DOT com Content-Type: text/plain; charset=windows-1252 Mime-Version: 1.0 (Mac OS X Mail 7.3 \(1878.6\)) Subject: Re: [geda-user] pcb-rnd: parametric footprints (status update) From: John Doty In-Reply-To: <55ABC8D2.9020109@dbtgroup.com> Date: Sun, 19 Jul 2015 12:40:37 -0600 Message-Id: References: <3A58F277-5408-4D0D-B138-CCC209397ADF AT noqsi DOT com> <55ABC8D2 DOT 9020109 AT dbtgroup DOT com> To: geda-user AT delorie DOT com X-Mailer: Apple Mail (2.1878.6) Content-Transfer-Encoding: 8bit X-MIME-Autoconverted: from quoted-printable to 8bit by delorie.com id t6JIejrd024805 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Jul 19, 2015, at 9:57 AM, Yvette S. Hirth, CCP, CDP (yvette AT dbtgroup DOT com) [via geda-user AT delorie DOT com] wrote: > On 07/19/2015 08:31 AM, John Doty wrote: > > (snippage) >> We have a standard for footprint naming that applies to more than 95% of components: >> http://wiki.geda-project.org/geda:pcb_footprint_naming_conventions. > >> That’s the place to start. I think these are what belong in library components. > (snippage) > > hrm. i note that there are dups in the "standard for footprint naming": > > > Dual in line packages with up to 22 100 mil spaced pins and 300 mil > row spacing are called DIPn. > > Dual in line packages with 24 or more 100 mil spaced pins and 300 mil > row spacing are called DIPnN. > > Dual in line packages with 100 mil spaced pins and 400 mil row > spacing are called DIPnH. > > Dual in line packages with 24 or more 100 mil spaced pins and 600 mil > row spacing are called DIPn. > > Shrink dual in line packages with up to 24 70 mil spaced pins and 300 > mil row spacing are called SDIPn. > > Shrink dual in line packages with more than 24 70 mil spaced pins and > 400 mil row spacing are called SDIPn. > > so "DIPn" refers to inline packages that have both 300mil row spacing Only if they have less than 24 pins. > and 600mil row spacing, Only if they have more than 22 pins. > and "SDIPn" refers to inline packages with 300mil row spacing Only if they have less than 26 pins. > and 400mil row spacing. Only if they have more than 24 pins. > > shouldn't they (diff DIP packages with diff row spacing) be unique? They are unique, just not in the way you expect. It’s a minor short cut, based, I suppose, on the idea that the longer DIP packages tend to be wider. Make those DIPn, make the exceptions DIPnN. I wouldn’t have done it that way, but it’s what we’ve had for years, and it’s not terrible. John Doty Noqsi Aerospace, Ltd. http://www.noqsi.com/ jpd AT noqsi DOT com