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Date: Sun, 19 Jul 2015 08:57:06 -0700
From: "Yvette S. Hirth, CCP, CDP (yvette AT dbtgroup DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
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Subject: Re: [geda-user] pcb-rnd: parametric footprints (status update)
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On 07/19/2015 08:31 AM, John Doty wrote:

(snippage)
> We have a standard for footprint naming that applies to more than 95% of components:
> http://wiki.geda-project.org/geda:pcb_footprint_naming_conventions.

> That’s the place to start. I think these are what belong in library components.
(snippage)

hrm.  i note that there are dups in the "standard for footprint naming":

 > Dual in line packages with up to 22 100 mil spaced pins and 300 mil
   row spacing are called DIPn.
 > Dual in line packages with 24 or more 100 mil spaced pins and 300 mil
   row spacing are called DIPnN.
 > Dual in line packages with 100 mil spaced pins and 400 mil row
   spacing are called DIPnH.
 > Dual in line packages with 24 or more 100 mil spaced pins and 600 mil
   row spacing are called DIPn.
 > Shrink dual in line packages with up to 24 70 mil spaced pins and 300
   mil row spacing are called SDIPn.
 > Shrink dual in line packages with more than 24 70 mil spaced pins and
   400 mil row spacing are called SDIPn.

so "DIPn" refers to inline packages that have both 300mil row spacing 
and 600mil row spacing, and "SDIPn" refers to inline packages with 
300mil row spacing and 400mil row spacing.

shouldn't they (diff DIP packages with diff row spacing) be unique?

yvette