X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:from:date:message-id:subject:to :content-type; bh=0WzlBFPapnq/ZZO6loK+xJVLfpAe1bLvlUyhER3aDGg=; b=ZUwZ2XHCSXeyzKgRie/YwEHwVCh5ob4+UqZ/iIPHyrWlK3CvphMkR149EufivXlnnU yUImCKQwHNWri3Ig1Th8e3Vosa89U8BbIYE0tKQBDeM91W5cInE07vLL6w/bUa4WhAaQ ot59EYNuaUQTmOGaELF9uFpqDBRcmhXejBWaODBtl0wBYDFAk8rJHWfebXaA2P+Q4ZbG K1Af14kNeXAthA08Sq5VilGlcEUzKmSXW5fcy1Kqx/1Ru2xGnNTg9A9muCo17pbo1MsG hiL40xI8ooG96yiMbVxG/SxTGf5Qdk8y/pAUKIE4xF6szN//Zvi5qkW1V0jbGI/6DK6t gatA== X-Received: by 10.112.72.164 with SMTP id e4mr33008541lbv.113.1436805347219; Mon, 13 Jul 2015 09:35:47 -0700 (PDT) MIME-Version: 1.0 In-Reply-To: <55A3E456.9070104@ecosensory.com> References: <76520AC3-3E8D-4F80-A912-AB076DD8D0C6 AT icloud DOT com> <1436782404 DOT 960 DOT 19 DOT camel AT ssalewski DOT de> <55A3E456 DOT 9070104 AT ecosensory DOT com> From: "Ala'a Mohammad (amalawi AT gmail DOT com) [via geda-user AT delorie DOT com]" Date: Mon, 13 Jul 2015 20:35:07 +0400 Message-ID: Subject: Re: [geda-user] PCB interface (ECAD vs. MCAD) To: geda-user AT delorie DOT com, john AT ecosensory DOT com Content-Type: multipart/alternative; boundary=001a11c2b616551fde051ac45001 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --001a11c2b616551fde051ac45001 Content-Type: text/plain; charset=UTF-8 On Mon, Jul 13, 2015 at 8:16 PM, John Griessen wrote: -- > > Some day soon, we are going to be able to 3D print a pcb with conductor > layers > and good insulation, and be non-planer even. For instance a pcb with > brackets built in, and some > SMD lands at 90 degrees to the main ones. Also 8 layer boards just for > good grounding and shielding with > minimal extra cost for low volumes, probably easy to afford extra cost as > you go up in volume by reducing BOM > parts count and final assembly effort. > some first steps in that direction http://www.voltera.io/ and http://www.voxel8.co/ --001a11c2b616551fde051ac45001 Content-Type: text/html; charset=UTF-8 Content-Transfer-Encoding: quoted-printable

= On Mon, Jul 13, 2015 at 8:16 PM, John Griessen <john AT ecosensory DOT com&= gt; wrote:
--
Some day soon, we are going to be able to 3D print a pcb with conductor lay= ers
and good insulation, and be non-planer even.=C2=A0 For instance a pcb with = brackets built in, and some
SMD lands at 90 degrees to the main ones.=C2=A0 Also 8 layer boards just fo= r good grounding and shielding with
minimal extra cost for low volumes, probably easy to afford extra cost as y= ou go up in volume by reducing BOM
parts count and final assembly effort.
some first step= s in that direction
and
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