X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Date: Thu, 19 Feb 2015 20:53:13 +0100 From: Florian Teply To: geda-user AT delorie DOT com Subject: Re: [geda-user] Commonness of internal layer cutouts/cavities? Message-ID: <20150219205313.49d053a1@aluminium.mobile.teply.info> In-Reply-To: References: X-Mailer: Claws Mail 3.9.0 (GTK+ 2.24.16; powerpc-unknown-linux-gnu) Mime-Version: 1.0 Content-Type: text/plain; charset=US-ASCII Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk Am Sun, 15 Feb 2015 09:08:55 -0500 schrieb Jason White : > How common are cavities (that is internal cutouts on a PCB specific to > a single layer) in the electronics world? > Well, for me, that's actually a pretty common thing. But this doesn't mean anything. Most of these boards I do specifically for some delicate Chip-on-Board solutions though, where I'm just too lazy to think about having the silicon packaged, or when I need to adapt between actual die pinout and package pin assignment. And in these cases, it's either a plain hole through the whole board (for thin boards) or mechanical milling to reduce height difference for bonding. On has to make sure though not to put traces there... Best regards, Florian