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Date: Wed, 28 Jan 2015 20:10:49 +0100
From: Olliver Schinagl <oliver+list AT schinagl DOT nl>
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To: geda-user AT delorie DOT com
Subject: [geda-user] Move par labels (or how about handeling multi footprint parts?)
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Reply-To: geda-user AT delorie DOT com

Hey list,

I've always wondered how you guys are doing multi-footprint boards? Like 
SMD and TH resistors for example. Or SOT and DIP chips? Currently I 
design my schema, then when i'm happy with it, copy it, change the 
footprints and labels, and make a pcb from it. This is tiresome, but is 
doable. The labels however, become a big problem though. I have dupes, 
like R101 and R201.

More so, when designing really small PCB's, i may not even want the 
labels, or put the labels on a different layer, so that I can or cannot 
export it to gerber. With labels for the PDF for example, without for 
the PCB.

Or am I overlooking something stupidly obvious? (on both accounts)

Thanks,

Olliver