X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f Date: Sat, 28 Jun 2014 22:17:55 -0400 Message-Id: <201406290217.s5T2Ht48017307@envy.delorie.com> From: DJ Delorie To: geda-user AT delorie DOT com In-reply-to: <1404004663.18463.42.camel@pcjc2lap> (message from Peter Clifton on Sun, 29 Jun 2014 02:17:43 +0100) Subject: Re: [geda-user] pcb: Patch for arcs with different radii for x and y on screen References: <53A7E8F0 DOT 8020905 AT philippklostermann DOT de> <1403800440 DOT 25929 DOT 14 DOT camel AT pcjc2lap> <20140627112707 DOT GB21723 AT visitor2 DOT iram DOT es> <1403900109 DOT 6474 DOT 8 DOT camel AT pcjc2lap> <877g422gyf DOT fsf AT rover DOT gag DOT com> <1403918513 DOT 6474 DOT 37 DOT camel AT pcjc2lap> <874mz53cxn DOT fsf AT rover DOT gag DOT com> <1403964458 DOT 21012 DOT 13 DOT camel AT pcjc2lap> <201406281614 DOT s5SGEm2m030282 AT envy DOT delorie DOT com> <1404004663 DOT 18463 DOT 42 DOT camel AT pcjc2lap> Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > > I've used both types of tools, and IMHO it's better to have a "canned" > > geometry that you can reference, as well as making exceptions. > > Sketchup has a good implementation of this, but lacks a way of finding > > all features that are exceptions. > > Is this in favour of, or against indirecting through reference to a > separately defined padstack? (We could still choose to copy-on-write, or > edit-all when modifying vias / pads). In general, in favor of. The trick is handling the exceptions properly. I'm also in favor of storing footprints that way, so you could (for example) update all your 0603 footprints at once. > Would a pad-stack definition be explicit for the board stack-up in use, > or would it more usefully read something like: > > TOP PASTEMASK LAYER : Round 2.0mm > TOP SOLDERMASK LAYER : Round 2.2mm > TOP (or START?) LAYER : Round 2.0mm Clear Round 2.4mm > INTERMEDIATE LAYER : Round 2.1mm Clear Round 2.5mm > BOTTOM (or END?) LAYER : Round 2.0mm Clear Round 2.4mm > BOTTOM SOLDERMASK LAYER : Round 2.2mm > BOTTOM PASTEMASK LAYER : Round 2.0mm I think pad stacks, and footprints in general, need a more "semantic" stackup (like your example) that can be merged to any actual layer stack. > The additive combination of multiple underlying layers is a nuisance > from a code point of view.. it means we need to combine these various > data-sources to check for connectivity, and it means some operations can > be slowed - as the spatial indexes are kept per-layer, not per group. I think we need additive and subtractive layers, though. Managing connectivity is no harder than what we have now, if we design suitable iterators. The only trick will be managing polygons - we'd need to cache an "effective polygon set" for connectivity purposes. > IMO, although the history pre-dates my involvement, PCB's layer groups > only really exist as a substitute for being able to tag objects by > class, or property. And pretty colors :-) > > Photo mode does this too, and OSH Park interprets PCB layouts this > > way. > > Does photo mode use anything other than the outer-layers though? Yes. If you do a four-layer board, you can see shadows of the inner layers through the outer layers, just like a real board.