X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Cam-AntiVirus: no malware found X-Cam-ScannerInfo: http://www.cam.ac.uk/cs/email/scanner/ Message-ID: <1403900109.6474.8.camel@pcjc2lap> Subject: Re: [geda-user] pcb: Patch for arcs with different radii for x and y on screen From: Peter Clifton To: geda-user AT delorie DOT com Date: Fri, 27 Jun 2014 21:15:09 +0100 In-Reply-To: <20140627112707.GB21723@visitor2.iram.es> References: <53A7E8F0 DOT 8020905 AT philippklostermann DOT de> <1403800440 DOT 25929 DOT 14 DOT camel AT pcjc2lap> <20140627112707 DOT GB21723 AT visitor2 DOT iram DOT es> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.10.4-0ubuntu1 Mime-Version: 1.0 Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Fri, 2014-06-27 at 13:27 +0200, Gabriel Paubert wrote: > But if you are going to change the file format, there are other things > to introduce: > - blind and buried vias > - arbitrarily rotated text > - contours with arcs boundaries (I know you had a patch for this) > - correct square pads > - complex pads (look at an MC15XS3400 for fun) All changes take effort.. and time. (The latter I have little of). I've done a bit of work towards contours with arcs (poly-curves), and I'd love to see poly-curve pads. Square, rectangular, round - then ALL become poly-curve outlines. Blind and burried vias, I don't know how to implement. I've never used them, and whilst I'm familiar in theory with how they are built up into boards, I'm not sure how best to represent them within PCB, or how one would interact with them in the editor. How would you select from/to layers? Would we constrain the end-points to physically realisable ones? IE... should I allow modelling a via that would not be possible to achieve, e.g. from layer 1-5 in a 6 layer board? How does all this interact with moving objects etc.. between layers? How are blind and buried vias represented for manufacturing? Different drill-files for each of the from-to layer pairs? Should we pre-define a list of legal vias (like pad-stacks), and then allow choice between them, or should each one be completely independently defined? BTW.. glad you mentioned the MC15xS3400 - I just took a look at it, and think it may be very useful for an application I have! Sometimes random how things come together! -- Peter Clifton Clifton Electronics