X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com From: Christian Riggenbach To: geda-user AT delorie DOT com Subject: Re: [geda-user] Via under a pad? Date: Sat, 08 Mar 2014 03:58:45 +0100 Message-ID: <2396921.4Th0lLeXra@jasum> User-Agent: KMail/4.12.3 (Linux/3.13.5-1-ARCH; KDE/4.12.3; x86_64; ; ) In-Reply-To: References: MIME-Version: 1.0 Content-Transfer-Encoding: 7Bit Content-Type: text/plain; charset="us-ascii" Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk Am Donnerstag 27 Februar 2014, 15.01:21 schrieben Sie: > Is it bad practice to put vias under pads? These pads are twice as big as > the vias. When you only solder by hand, its not a problem. I even placed a via with a hole of 3mm under a pad of a DFN to solder "through" the pcb and connect the center pad ;) -- mit freundlichem Gruss Christian Riggenbach