X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Message-ID: <530FA6A2.9030209@estechnical.co.uk> Date: Thu, 27 Feb 2014 20:57:06 +0000 From: Ed Simmons User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:24.0) Gecko/20100101 Thunderbird/24.3.0 MIME-Version: 1.0 To: geda-user AT delorie DOT com Subject: Re: [geda-user] Via under a pad? References: In-Reply-To: Content-Type: text/plain; charset=ISO-8859-1; format=flowed Content-Transfer-Encoding: 7bit X-Authenticated-As: ed AT estechnical DOT co DOT uk X-Extend-Src: mailout Reply-To: geda-user AT delorie DOT com Hi Rob, On 27/02/14 20:01, Rob Butts wrote: > Is it bad practice to put vias under pads? These pads are twice as > big as the vias. > > Just curious. Can you afford the via being much smaller? We put vias 'in pad' but make sure they're really small so they don't suck up away the solder. Typically, I tend to try and place vias next to the pad unless absolutely necessary. On the other hand, for heat sinking with the PCB, we use an array of the smallest vias our fab house will drill (0.2mm hole) under the large heat sink pad of SMT mosfets or transistors, with a large copper fill on as many layers as possible to dissipate the heat. It depends on what you're doing as to which approach is right. ;-) Hope that helps! Ed