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From: Kai-Martin Knaak <knaak AT iqo DOT uni-hannover DOT de>
Subject: Re: [geda-user] Solder-thickened traces
Date: Fri, 24 Jan 2014 14:24:47 +0100
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References: <20140124101236 DOT GT11870 AT fi DOT muni DOT cz> <20140124105947 DOT 20436 DOT qmail AT stuge DOT se> <20140124111028 DOT GV11870 AT fi DOT muni DOT cz>
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Jan Kasprzak wrote:

> : The only thing that comes to my mind is to make an element with a
> : long pad, which will be that trace.
> 
> It would be possible, but it would not allow for an arbitrary
> shape of the trace.
> 

1) select the traces
2) copy selection to buffer
3) convert buffer to element
4) paste buffer to layout

result: step 3 produces a footprint with lots of overlapping pads that 
combine to yield the shape of the traces.

I used this technique to upgrade 3 mm width traces for use with 10 amps. 
To be extra safe, I included a 1.5 mm diameter copper wire in the solder 
trace.

---<)kaimartin(>---