X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f
X-Recipient: geda-user AT delorie DOT com
X-Envelope-From: paubert AT iram DOT es
Date: Fri, 24 Jan 2014 12:31:18 +0100
From: Gabriel Paubert <paubert AT iram DOT es>
To: geda-user AT delorie DOT com
Subject: Re: [geda-user] Solder-thickened traces
Message-ID: <20140124113118.GA15885@visitor2.iram.es>
References: <20140124101236 DOT GT11870 AT fi DOT muni DOT cz>
MIME-Version: 1.0
Content-Type: text/plain; charset=us-ascii
Content-Disposition: inline
In-Reply-To: <20140124101236.GT11870@fi.muni.cz>
User-Agent: Mutt/1.5.20 (2009-06-14)
X-Spamina-Bogosity: Ham
Reply-To: geda-user AT delorie DOT com
Errors-To: nobody AT delorie DOT com
X-Mailing-List: geda-user AT delorie DOT com
X-Unsubscribes-To: listserv AT delorie DOT com
Precedence: bulk

On Fri, Jan 24, 2014 at 11:12:36AM +0100, Jan Kasprzak wrote:
> 	Hello,
> 
> while examining a controller board from an old washing machine :-) I have
> discovered that they have some of the high-current traces partly without the
> solder mask and thickened by adding a solder (HASL) to them. How can I do
> this in pcb?

I do this regularly for RF signals (solder mask, at least run of the mill 
variety, increases transmission line losses at microwave frequencies). 

However, I do this in a very kludgy way: I generate an additional (internal) 
copper layer and then I merge the Gerber files manually, first removing the 
via pads on the additional layer.

It should be possible to do it automatically, for example if layers 
in PCB names matching ".*topmask.*" and ".*botttommask.*" were merged
with the automatically generated soldermasks at export time.

	Cheers,
	Gabriel