X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Message-ID: <1387294915.2039.10.camel@AMD64X2.fritz.box> Subject: Re: [geda-user] pcb: solder mask clearance in DRC? From: Stefan Salewski To: geda-user AT delorie DOT com Date: Tue, 17 Dec 2013 16:41:55 +0100 In-Reply-To: <20131217135658.GA9938@visitor2.iram.es> References: <52B0214C DOT 8030700 AT envinsci DOT co DOT uk> <1387284113 DOT 2039 DOT 9 DOT camel AT AMD64X2 DOT fritz DOT box> <20131217135658 DOT GA9938 AT visitor2 DOT iram DOT es> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.8.5 Mime-Version: 1.0 Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Tue, 2013-12-17 at 14:56 +0100, Gabriel Paubert wrote: > I have to disagree, for the finest pitch BGA, the solder mask aperture > is actually smaller than the pad. The pads are said to be SMD > (solder mask defined), while traditional pads (defined by the copper > area) are said to be NSMD (non solder mask defined). That is interesting -- I have never used BGA parts.