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Date: Mon, 26 Aug 2013 13:33:14 -0700
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Subject: Re: [geda-user] keeping solder mask off thermal rectangles?
From: Russell Dill <Russ DOT Dill AT asu DOT edu>
To: geda-user AT delorie DOT com
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On Mon, Aug 26, 2013 at 11:04 AM, Britton Kerin <britton DOT kerin AT gmail DOT com> wrote:
>
> I've got a part with a thermal pad on the bottom of a SOIC package.
>
> I was able to create rectangles on the solder and component sides of the
> board, then connect them with vias, and turn the vias into thermals with
> complete connections using thermal tool and shift-click.

Pretty sure you want to *not* use thermals in this case, just a solid
connection.

> The last thing I think I want to do is keep the solder mask off the
> rectangular areas.  I think.  Or perhaps it doesn't really matter for heat
> dissipation?
>
> Anyway I haven't been able to sort out how to do this last thing.
> Suggestions?
>
> Thanks,
> Britton
>