X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:date:message-id:subject:from:to:content-type; bh=86h+1BqtEmbWcqyHatzfpm3UUJJ41B8xXfczZRFuY5E=; b=dtmUKObG4OlUhIDefksm1VogUNQcwuif5NW8rLv6dXvUz/eJmzGB4MyBJ2tUDNmjSk 4WRFP6xKgn1lloftk2rC0GWuzeL0vtqW8gobCFt13Yr/tUkceuBC1Mh38f+fbGyiQFFH BjHrJ8SM4vzWnHV/jKERJGxycLSmo2TA3Oc0gju9P2kd9k25mQ+AHvm/zdBsJ55pjlL4 D+ZoD+QoyQhM8ol8J++k2P7oZw4Y4gCXNoRcZAJJVwoG+w4ti7f7rcpKkHZnfRyj1HKB Eqz/ZaD32p0D5z3g2XiU97NQoZ0/gGms7W8CvmjNuwY8LeT1o7nRF3FfGd/8kQAbY0cN He1w== MIME-Version: 1.0 X-Received: by 10.180.126.9 with SMTP id mu9mr8378458wib.16.1377540244957; Mon, 26 Aug 2013 11:04:04 -0700 (PDT) Date: Mon, 26 Aug 2013 10:04:04 -0800 Message-ID: Subject: [geda-user] keeping solder mask off thermal rectangles? From: Britton Kerin To: geda-user AT delorie DOT com Content-Type: multipart/alternative; boundary=e89a8f839d29f6f34c04e4dd94d3 Reply-To: geda-user AT delorie DOT com --e89a8f839d29f6f34c04e4dd94d3 Content-Type: text/plain; charset=ISO-8859-1 I've got a part with a thermal pad on the bottom of a SOIC package. I was able to create rectangles on the solder and component sides of the board, then connect them with vias, and turn the vias into thermals with complete connections using thermal tool and shift-click. The last thing I think I want to do is keep the solder mask off the rectangular areas. I think. Or perhaps it doesn't really matter for heat dissipation? Anyway I haven't been able to sort out how to do this last thing. Suggestions? Thanks, Britton --e89a8f839d29f6f34c04e4dd94d3 Content-Type: text/html; charset=ISO-8859-1 Content-Transfer-Encoding: quoted-printable

I've got a part with a thermal pad on the bottom o= f a SOIC package.

I was able to create rectangles on the solder and = component sides of the board, then connect them with vias, and turn the via= s into thermals with complete connections using thermal tool and shift-clic= k.

The last thing I think I want to do is keep the solder mask off the rec= tangular areas.=A0 I think.=A0 Or perhaps it doesn't really matter for = heat dissipation?

Anyway I haven't been able to sort out how to = do this last thing.=A0 Suggestions?

Thanks,
Britton

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