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Date: Thu, 18 Jul 2013 09:19:25 -0400
Message-ID: <CALSZ9goF9oRVUfHM_UDyM60Kr=x4ONsXVtnVe4VJdm=F9YmDBg@mail.gmail.com>
Subject: [geda-user] PCB BGA (ball grid array) Package/Footprint
From: Rob Butts <r DOT butts2 AT gmail DOT com>
To: geda-user AT delorie DOT com
Content-Type: multipart/alternative; boundary=001a11c24eb022415904e1c90f8a
Reply-To: geda-user AT delorie DOT com

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Has anyone done a PCB using the new chips with the BGA (ball grid array)?
If so, how did you define the footprint?  As through-holes?  Fab shops must
be capable of accommodating these ICs otherwise they wouldn't exist.

I'm thinking they must be easy to solder since it would simply fall into
it's position with either pre-soldered holes or pre-soldered pins/balls.

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<div dir=3D"ltr"><div>Has anyone done a PCB using the new chips with the=A0=
BGA (ball grid array)?=A0 If so, how did you define the footprint?=A0 As th=
rough-holes?=A0=A0Fab shops must be capable of accommodating these ICs othe=
rwise they wouldn&#39;t exist.=A0 </div>
<div>=A0</div><div>I&#39;m thinking they must be easy to solder since it wo=
uld simply fall into it&#39;s position with either pre-soldered holes or pr=
e-soldered pins/balls.</div></div>

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