X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Message-ID: <4FEC09F7.8050904@gmail.com> Date: Thu, 28 Jun 2012 09:38:31 +0200 From: 1tmt User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:10.0.3) Gecko/20120324 Icedove/10.0.3 MIME-Version: 1.0 To: Subject: Re: [geda-user] TPS40210 thermal pad References: <20120528201658 DOT GB16992 AT malakian DOT lan> In-Reply-To: <20120528201658.GB16992@malakian.lan> Content-Type: text/plain; charset="ISO-8859-1" Content-Transfer-Encoding: 7bit X-TI-ClientIp: 79.29.39.72 Reply-To: geda-user AT delorie DOT com Andrew Poelstra ha scritto lo scorso 28/05/2012 22:16: > > Hey all, > > Does anyone have experience with the TPS40210 switching power > supply? It is a fairly new chip from TI. > > My question is: can I connect the thermal relief pad to GND? > The datasheet says nothing about internal connections to the > thermal pad. > Hi, not sure about 40210, but I've already used the TPS5450 (SO8+PowerPad) and the TPS62172 (WSON8+PowerPad); in both cases I connected the PwPad to ground (and to an "onsolder,nopaste" pad connected by vias to the component-side PwPad for thermal dissipation and - mainly - for paste draining).