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Date: Mon, 30 Apr 2012 06:43:17 -0700
From: Colin D Bennett <colin AT gibibit DOT com>
To: geda-user AT delorie DOT com
Subject: Re: [geda-user] Re: [coreboot] Dual SPI Flash adapter attempt 2.0
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On Sat, 28 Apr 2012 15:44:59 +0200
Oliver Schinagl <oliver+list AT schinagl DOT nl> wrote:

> On 04/27/12 19:50, Colin D Bennett wrote:
> > On Fri, 27 Apr 2012 11:32:35 +0200
> > Oliver Schinagl<oliver+list AT schinagl DOT nl>  wrote:
> >
> >> Wow, nice big review :D feedback!
> >>
> >> On 04/27/12 02:08, Peter Stuge wrote:
> >>> The SMD ICs and RN all have the package outline on silk
> >>> absolutely tight around the soldermask apertures. Avoid this,
> >>> again because the silk is way too close to the pads, and you
> >>> never want silk anywhere outside the solder mask.
> >
> > Will the PCB fab house automatically remove silk from regions
> > too close to holes in solder mask?  Laen's PCB fab does this,
> > so I am sloppy and use silk screen tighter than is actually
> > producible, for layout assistance (I wish pcb had some extra
> > virtual layers in footprints like "placement courtyard",
> > "keepout", etc. so we didn't have to abuse the silk screen for
> > everything).
>  From what Peter told me, most PCB fab houses won't. Laen
> probably hand edits the gerbers I guess?

I seriously doubt the silk is clipped to solder mask by hand.
Certainly it is automated, and I expect the board fab house does it
unconditionally.  Maybe others with more experience can attest
better, but I've heard that most PCB fab houses will clip the
silk screen away from pads automatically.  I guess you can just ask
your fab house.

Regards,
Colin