X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com Message-ID: <20120427002113.27271.qmail@stuge.se> Date: Fri, 27 Apr 2012 02:21:13 +0200 From: Peter Stuge To: coreboot AT coreboot DOT org, geda-user AT delorie DOT com Subject: [geda-user] Re: [coreboot] Dual SPI Flash adapter attempt 2.0 Mail-Followup-To: coreboot AT coreboot DOT org, geda-user AT delorie DOT com References: <4F915B7C DOT 9000009 AT schinagl DOT nl> <4F959E1F DOT 6010803 AT schinagl DOT nl> <4F997E2E DOT 7010306 AT schinagl DOT nl> <4F99CEFD DOT 10707 AT schinagl DOT nl> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <4F99CEFD.10707@schinagl.nl> Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk Oliver Schinagl wrote: > So the big question is; shall I send this to seeed for fabrication > or does it need some big change? One last thing (I think) is to check if the 20 mil = 0.5 mm Y-axis clearance between the individual boards will actually work. Even the 60 mil = 1.52 mm X-axis clearance is rather small if they are doing a disk cut. If they only V score the outline and then break them apart mechanically then the 20 mil is fine. The boards I have do have flush edges however, so they were disc cut, and the disc is likely wider than 0.5 mm => you need to increase Y clearance or perhaps simply throw out the U1 pins and make it SO only. //Peter