X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com X-Injected-Via-Gmane: http://gmane.org/ To: geda-user AT delorie DOT com From: Kai-Martin Knaak Subject: [geda-user] Re: Dual SPI Flash adapter attempt 2.0 Date: Fri, 27 Apr 2012 01:20:51 +0200 Lines: 38 Message-ID: References: <4F915B7C DOT 9000009 AT schinagl DOT nl> <4F959E1F DOT 6010803 AT schinagl DOT nl> <4F997E2E DOT 7010306 AT schinagl DOT nl> <4F99CEFD DOT 10707 AT schinagl DOT nl> Mime-Version: 1.0 Content-Type: text/plain; charset="ISO-8859-1" Content-Transfer-Encoding: 7Bit X-Complaints-To: usenet AT dough DOT gmane DOT org X-Gmane-NNTP-Posting-Host: a89-183-19-243.net-htp.de User-Agent: KNode/4.4.11 Cc: coreboot AT coreboot DOT org Reply-To: geda-user AT delorie DOT com Oliver Schinagl wrote: > Somehow I managed to mirror one of my labels on a component. So the > part was on the top side, while the label looked like it was on the > bottom side. Long story short, i just deleted the part, and copied it > from the neighboring part. Due to all the renaming though, I get all > strange connects when using the automated rats nest, but I guess > that's the price to pay. I prefer to drive my layout with gschem. That is, all parts in the layout are also mentiond in the schematic - no manual insertion of footprints in pcb. For a multiple instances like in your layout can be achieved with a hierarchical schematic. > So the big question is; shall I send this to seeed for fabrication The outline lines should look more simple. The gerbers expicitely call for a milled edge at the middle of each line. So ther should be a single line where you expect the fab to cut the board. The fabs I know, would object against such a multiple part layout and charge extra for their increased handling effort. They prefer layouts in one piece. Copper lines look a bit on the skinny side. If they are more beefy the manufactured board can be tweaked more easily. Depending on the currents, ground and supply may benefit from increased line thickness. If S1 and S2 are SMD supposed to be jumpers, then it may be hard to close them with a solder iron. The pads should be much wider than the gab to make the solder bridge more likely. ---<)kaimartin(>--- -- Kai-Martin Knaak, Email: kmk AT familieknaak DOT de http://pool.sks-keyservers.net:11371/pks/lookup?search=0x6C0B9F53 Still unhappy with moderation of geda-user. Why? Because it is completely intransparent.