X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=mime-version:in-reply-to:references:date:message-id:subject:from:to :content-type; bh=Bc34/FZ/BilJXdf21gU6sq+wku4qUVbpCtYDjSOcwZM=; b=cAcJZLmYA85R3JwI0wqbhQNRR9l5TEr1crSzNnGh+FO65tymurEWsdl0STPnOkANXl gty9gbEfGlV5oFJsfAPOSrbYM9lM72cZaLkcnNQnQEE0C5iRjQzg+PSbpkXb9pNdV6p+ t+S24W4LUoQ0BSeBGzBE+4MllcdOUUex2gcUiO7vNdJFM4JHJEWUU6MTj2XyBFG6FBSi fKoiACy3JpIw/ueIQOWdFMo9P0Ny2vzM76+weMR0t6yCcMwTS9u99FR/3L/o14+m2cnT sGB8hO8zBh4AZFGNK+Kv/3mXZvmrp+AKHe7rM4Zqza2SE2GbFrK/xD3y3lPnWbvoLYiE XlLQ== MIME-Version: 1.0 In-Reply-To: <20120323165830.7e72da02@svelte> References: <20120323153154 DOT 31f9090d AT svelte> <201203232307 DOT q2NN7qL4011010 AT envy DOT delorie DOT com> <20120323165830 DOT 7e72da02 AT svelte> Date: Sat, 24 Mar 2012 06:50:19 -0400 Message-ID: Subject: Re: [geda-user] Solder paste/nopaste flag overlapping, and custom paste apertures From: Bob Paddock To: geda-user AT delorie DOT com Content-Type: text/plain; charset=ISO-8859-1 Reply-To: geda-user AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-user AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > I read an article somewhere that described a modification of this > where the QFN exposed pad is actually segmented by solder mask as > well as the paste stencil -- this keeps the solder evenly > distributed even if the chip tries to tilt a bit. It is only the stencil for the paste that should be segmented, to control the amount of the paste. The mask and pad should not be segmented.