X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com X-Virus-Scanned: Debian amavisd-new at smtp-vp01.sig.oregonstate.edu From: "Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com]" Content-Type: multipart/alternative; boundary="Apple-Mail=_31BD3074-156C-43F5-8EF9-D23E6C5519E9" Mime-Version: 1.0 (Mac OS X Mail 11.5 \(3445.9.7\)) Subject: Re: [geda-help] via in pad needs tenting...how? Date: Wed, 28 Apr 2021 10:50:25 -0700 References: <5CCF512C-E056-45DF-9C88-944406D6FBDD AT ece DOT orst DOT edu> <60890376 DOT 8030107 AT xs4all DOT nl> <6338EA12-23BE-404A-8AD1-ECD090E3982F AT ece DOT orst DOT edu> To: geda-help AT delorie DOT com In-Reply-To: Message-Id: <15DDA086-C0E3-4BA5-8F42-6605F5FA3554@ece.orst.edu> X-Mailer: Apple Mail (2.3445.9.7) Reply-To: geda-help AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-help AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --Apple-Mail=_31BD3074-156C-43F5-8EF9-D23E6C5519E9 Content-Transfer-Encoding: quoted-printable Content-Type: text/plain; charset=utf-8 Chad, Yes, I see that I can do that. However, I am back to my original = problem. I am finding that I can edit the solder paste layer in pub-rnd. Fooling around with that = presently. =20 Thanks for your assistance, Roger > On Apr 28, 2021, at 10:30 AM, Chad Parker (parker DOT charles AT gmail DOT com) = [via geda-help AT delorie DOT com] wrote: >=20 > It doesn't solve your problem of tenting them inside an area that's = already been cleared of soldermask for other reasons, but it is possible = to create tented vias on a board. If you go into Route Styles and set = "Mask Aperture" to 0, then vias you place in that style will have no = mask clearance.=20 >=20 > On Wed, Apr 28, 2021 at 11:16 AM Roger Traylor (traylor AT engr DOT orst DOT edu = ) [via geda-help AT delorie DOT com = ] > wrote: > Bert, >=20 > Exactly. I understand. I will have a talk with the assembly house to = see what we can do to > lessen the wicking through. This is the issue. =20 >=20 > Thanks for your advice. >=20 > Roger >=20 > > On Apr 27, 2021, at 11:40 PM, Bert Timmerman = (bert DOT timmerman AT xs4all DOT nl ) [via = geda-help AT delorie DOT com ] = > wrote: > >=20 > > Roger Traylor (traylor AT engr DOT orst DOT edu ) = [via geda-help AT delorie DOT com ] wrote: > >> Folks, > >> I have an RF part that needs five vias inside its bottom pad. = I=E2=80=99ve inserted the vias > >> but the were not tented to my surprise. Is there a way to tent = vias that are inside > >> a footprint's center pad? > >> Thanks in advance, > >> Roger Traylor > >> =20 > > Hi Roger, > >=20 > > I assume you want a tented via in an exposed pad to prevent solder = from wicking in the via ? > >=20 > > That would be a difficult feat to achieve in current pcb. > >=20 > > I have never tried this and I would not know if any fab houses are = able to deliver on that request. > >=20 > > Maybe pcb-rnd can help you. > >=20 > > Good luck and kind regards, > >=20 > > Bert Timmerman. >=20 >=20 --Apple-Mail=_31BD3074-156C-43F5-8EF9-D23E6C5519E9 Content-Transfer-Encoding: quoted-printable Content-Type: text/html; charset=utf-8 Chad,

Yes, I see that I can do that. = However, I am back to my original problem. I am finding that = I can

edit the solder paste layer in pub-rnd. = Fooling around with that presently.

Thanks for your assistance,

Roger

On Apr 28, 2021, at 10:30 AM, Chad Parker (parker DOT charles AT gmail DOT com) [via geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:

It doesn't solve your problem of tenting them inside an area = that's already been cleared of soldermask for other reasons, but it is = possible to create tented vias on a board. If you go into Route Styles = and set "Mask Aperture" to 0, then vias you place in that style will = have no mask clearance.

On Wed, Apr = 28, 2021 at 11:16 AM Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:
Bert,

Exactly. I understand. I will have a talk with the assembly house = to see what we can do to
lessen the wicking through. This is the issue.
=
Thanks for your advice.

Roger

> On Apr 27, 2021, at 11:40 PM, Bert Timmerman (bert DOT timmerman AT xs4all DOT nl) [via geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:
>
> Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote:
>> Folks,
>> I have an RF part that needs five vias inside its bottom = pad. I=E2=80=99ve inserted the vias
>> but the were not tented to my surprise. Is there a way to = tent vias that are inside
>> a footprint's center pad?
>> Thanks in advance,
>> Roger Traylor
>>
> Hi Roger,
>
> I assume you want a tented via in an exposed pad to prevent solder = from wicking in the via ?
>
> That would be a difficult feat to achieve in current pcb.
>
> I have never tried this and I would not know if any fab houses are = able to deliver on that request.
>
> Maybe pcb-rnd can help you.
>
> Good luck and kind regards,
>
> Bert Timmerman.

= --Apple-Mail=_31BD3074-156C-43F5-8EF9-D23E6C5519E9--