X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com X-Original-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:references:in-reply-to:from:date:message-id:subject:to; bh=EwfkCvqUP6j+5/L2X9MzAg+QQSL/TwPvhSZkwmeN71I=; b=NcAaWxk0WlgyK5Podrgku5l1rkpWB5wnQshSuj/XHqIRCLQeCsdkR6EAJLPPJm5G5S sGYnsNdw2OIijRZvsyInxKWXZiEW+2UiNQgwOASCy4aO0tMgPq/y8lrrOh5ezotcHVNq vneprZ5D4T/54qFUt+Fn729vNYmI8XBo+NL1cOFL090ZLL3uRK1T43eq3zsYRNYzZYAN z6qIW3m7UjcXeBX12qlU2w8X6Uu9MTG+n+P19DuMgHIELC++1capOsfAzCc35MPPIPFK LbhEAiFSEB1YiVvl5Hm7mhg4+kPY4Yv+7lM9pvA1jwAsncdq6XhmyYMeKDOL3PaF2aGq SxmQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:mime-version:references:in-reply-to:from:date :message-id:subject:to; bh=EwfkCvqUP6j+5/L2X9MzAg+QQSL/TwPvhSZkwmeN71I=; b=L4kfCvptf/qXIs2yQVSeoU4Qdx+dS420NOgKq3Ho0wauON1/mrM7a3bvqlqDyPIFxD a624mgAsU5VLVxR6WCQSyyyALLFR1oYNCawfIDRs+HTh4o6Ifacmrg5ikfiXySAAMYsA K7A+WclTp0iza5YojZm4+dy7UXv+UgVx/S1wZXjlOOLrCSYlOkGEzOvTusdDjaQfGhAO byyJDssmJXiJYJnTfFDgSanihtsfceTHk+OnuN4H8MKMI3uM61tKaU3qKTMLnsE0xtcm 4MbL2dZVHe0SqBuSGSm8zyaqkCiAg+Fnib4arcgiY5coZ/vaQW1hYzs5ocFaVZTI8eNL WUNg== X-Gm-Message-State: AOAM530uimr8VufIQuUp4mSF8hRwv2GuHWhzB+PYTi4hKmM1CWouyos1 5MgvRfty6lY6COqc5enTx6KOVRGsg/SZFc9h/BSARzusOa4= X-Google-Smtp-Source: ABdhPJw6sNb8TLM67ksZ7oAuGQomKsOLlkAQfc4DGyHZyxUcw2WJWdENAi5RHPEk170zPkWayRLIIxLWX3COiudfWQA= X-Received: by 2002:a67:c907:: with SMTP id w7mr26436988vsk.48.1619631067283; Wed, 28 Apr 2021 10:31:07 -0700 (PDT) MIME-Version: 1.0 References: <5CCF512C-E056-45DF-9C88-944406D6FBDD AT ece DOT orst DOT edu> <60890376 DOT 8030107 AT xs4all DOT nl> <6338EA12-23BE-404A-8AD1-ECD090E3982F AT ece DOT orst DOT edu> In-Reply-To: <6338EA12-23BE-404A-8AD1-ECD090E3982F@ece.orst.edu> From: "Chad Parker (parker DOT charles AT gmail DOT com) [via geda-help AT delorie DOT com]" Date: Wed, 28 Apr 2021 13:30:55 -0400 Message-ID: Subject: Re: [geda-help] via in pad needs tenting...how? To: geda-help AT delorie DOT com Content-Type: multipart/alternative; boundary="0000000000006ec4ff05c10bbee7" Reply-To: geda-help AT delorie DOT com --0000000000006ec4ff05c10bbee7 Content-Type: text/plain; charset="UTF-8" Content-Transfer-Encoding: quoted-printable It doesn't solve your problem of tenting them inside an area that's already been cleared of soldermask for other reasons, but it is possible to create tented vias on a board. If you go into Route Styles and set "Mask Aperture" to 0, then vias you place in that style will have no mask clearance. On Wed, Apr 28, 2021 at 11:16 AM Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote: > Bert, > > Exactly. I understand. I will have a talk with the assembly house to see > what we can do to > lessen the wicking through. This is the issue. > > Thanks for your advice. > > Roger > > > On Apr 27, 2021, at 11:40 PM, Bert Timmerman (bert DOT timmerman AT xs4all DOT nl) > [via geda-help AT delorie DOT com] wrote: > > > > Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote= : > >> Folks, > >> I have an RF part that needs five vias inside its bottom pad. I=E2=80= =99ve > inserted the vias > >> but the were not tented to my surprise. Is there a way to tent vias > that are inside > >> a footprint's center pad? > >> Thanks in advance, > >> Roger Traylor > >> > > Hi Roger, > > > > I assume you want a tented via in an exposed pad to prevent solder from > wicking in the via ? > > > > That would be a difficult feat to achieve in current pcb. > > > > I have never tried this and I would not know if any fab houses are able > to deliver on that request. > > > > Maybe pcb-rnd can help you. > > > > Good luck and kind regards, > > > > Bert Timmerman. > > > --0000000000006ec4ff05c10bbee7 Content-Type: text/html; charset="UTF-8" Content-Transfer-Encoding: quoted-printable
It doesn't solve your problem of tenting them inside a= n area that's already been cleared of soldermask for other reasons, but= it is possible to create tented vias on a board. If you go into Route Styl= es and set "Mask Aperture" to 0, then vias you place in that styl= e will have no mask clearance.

On Wed, Apr 28, 2021 at 11:16 AM Roger T= raylor (traylor AT engr DOT orst DOT edu)= [via geda-help AT delorie DOT com] &= lt;geda-help AT delorie DOT com> w= rote:
Bert,

Exactly.=C2=A0 I understand. I will have a talk with the assembly house to = see what we can do to
lessen the wicking through.=C2=A0 This is the issue.=C2=A0

Thanks for your advice.

Roger

> On Apr 27, 2021, at 11:40 PM, Bert Timmerman (bert DOT timmerman AT xs4all DOT nl) [via geda-help AT delorie.= com] <ged= a-help AT delorie DOT com> wrote:
>
> Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote:
>> Folks,
>> I have an RF part that needs five vias inside its bottom pad.=C2= =A0 I=E2=80=99ve inserted the vias
>> but the were not tented to my surprise.=C2=A0 Is there a way to te= nt vias that are inside
>> a footprint's center pad?
>> Thanks in advance,
>> Roger Traylor
>>=C2=A0 =C2=A0
> Hi Roger,
>
> I assume you want a tented via in an exposed pad to prevent solder fro= m wicking in the via ?
>
> That would be a difficult feat to achieve in current pcb.
>
> I have never tried this and I would not know if any fab houses are abl= e to deliver on that request.
>
> Maybe pcb-rnd can help you.
>
> Good luck and kind regards,
>
> Bert Timmerman.


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