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From: "Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
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Subject: Re: [geda-help] via in pad needs tenting...how?
Date: Wed, 28 Apr 2021 08:08:52 -0700
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Bert,

Exactly.  I understand. I will have a talk with the assembly house to see what we can do to
lessen the wicking through.  This is the issue.  

Thanks for your advice.

Roger

> On Apr 27, 2021, at 11:40 PM, Bert Timmerman (bert DOT timmerman AT xs4all DOT nl) [via geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:
> 
> Roger Traylor (traylor AT engr DOT orst DOT edu) [via geda-help AT delorie DOT com] wrote:
>> Folks,
>> I have an RF part that needs five vias inside its bottom pad.  I’ve inserted the vias
>> but the were not tented to my surprise.  Is there a way to tent vias that are inside
>> a footprint's center pad?
>> Thanks in advance,
>> Roger Traylor
>>   
> Hi Roger,
> 
> I assume you want a tented via in an exposed pad to prevent solder from wicking in the via ?
> 
> That would be a difficult feat to achieve in current pcb.
> 
> I have never tried this and I would not know if any fab houses are able to deliver on that request.
> 
> Maybe pcb-rnd can help you.
> 
> Good luck and kind regards,
> 
> Bert Timmerman.