X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com Date: Fri, 9 Dec 2016 17:09:45 +0100 (CET) X-X-Sender: igor2 AT igor2priv To: geda-help AT delorie DOT com X-Debug: to=geda-help AT delorie DOT com from="gedah AT igor2 DOT repo DOT hu" From: gedah AT igor2 DOT repo DOT hu Subject: Re: [geda-help] Pins and vias: different clearance per layer In-Reply-To: <1e0f83fc-2500-cef4-278e-e0af8b1f435e@mochima.com> Message-ID: References: <1e0f83fc-2500-cef4-278e-e0af8b1f435e AT mochima DOT com> User-Agent: Alpine 2.00 (DEB 1167 2008-08-23) MIME-Version: 1.0 Content-Type: TEXT/PLAIN; charset=US-ASCII; format=flowed Reply-To: geda-help AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-help AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk On Fri, 9 Dec 2016, Carlos Moreno wrote: > Hi, > > Essentially, what I'm trying to do is connect a pin or via > to a plane (e.g., ground plane) without thermal release > (i.e., solid connection). > > If I only have ground plane and no other layer has copper > filling, then I simply set the clearance = 0 for the via. > However, if I have one ground plane and one Vcc plane > (or copper filling in the signal layer(s)), then the trick > doesn't work. > > Can I accomplish this? Maybe instead of playing with > the clearance there may be a style for thermal that > makes a solid connection (or at least control over the > amount of thermal release, etc.) Yes, there's a thermal style with solid conn. Press shift + click the thermal tool on the via/pin to cycle. > > Any tips? (a solution involving manually editing the > text file is perfectly fine) Manual edit: add thermal(0S) in the flags (last "" field); the digit is the layer number. HTH, Igor2