X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f Date: Fri, 20 Nov 2015 13:13:24 -0500 Message-Id: <201511201813.tAKIDO8l012486@envy.delorie.com> From: DJ Delorie To: geda-help AT delorie DOT com In-reply-to: <564F4722.5080406@videotron.ca> (geda-help@delorie.com) Subject: Re: [geda-help] Thermal pad References: <564F4722 DOT 5080406 AT videotron DOT ca> Reply-To: geda-help AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-help AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk > Before I run into any unnecessary difficulties in layout I'd better > ask the experts. It's a DDA package, an SO8 with a thermal pad. It was > simple to add a pin 9 as a square pad inside the pins. My question is > what is the best way to add half a dozen vias to the pad that connect > electrically and thermally to the ground plane below? Regards Ian. Add them as pins (all numbered 9) and set the thermal flags in the footprint accordingly. You can also fiddle with the nopaste (I think) flag and add smt pads (also numbered 9) to pattern your paste accordingly.