X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com MIME-version: 1.0 Content-transfer-encoding: 7BIT Content-type: text/plain; CHARSET=US-ASCII; format=flowed To: geda-help AT delorie DOT com From: "Ian Chapman (ichapman AT videotron DOT ca) [via geda-help AT delorie DOT com]" Subject: [geda-help] Thermal pad Message-id: <564F4722.5080406@videotron.ca> Date: Fri, 20 Nov 2015 11:15:30 -0500 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:38.0) Gecko/20100101 Thunderbird/38.3.0 Reply-To: geda-help AT delorie DOT com Hi all, Before I run into any unnecessary difficulties in layout I'd better ask the experts. It's a DDA package, an SO8 with a thermal pad. It was simple to add a pin 9 as a square pad inside the pins. My question is what is the best way to add half a dozen vias to the pad that connect electrically and thermally to the ground plane below? Regards Ian.