X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com From: "McKay, Roy L [PHYSA]" To: "geda-help AT delorie DOT com" Subject: [geda-help] Split negative & positive solder mask Thread-Topic: Split negative & positive solder mask Thread-Index: Ac53LIj6IvnhDgsNTc6SN33GM4mIug== Date: Tue, 2 Jul 2013 14:00:47 +0000 Message-ID: Accept-Language: en-US Content-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: x-originating-ip: [129.186.151.167] Content-Type: multipart/alternative; boundary="_000_D2FF84E1E2337A488420C56B924CA62C3A73E252ITSDAG2Ditsiast_" MIME-Version: 1.0 X-PMX-Version: 6.0.2.2308539, Antispam-Engine: 2.7.2.2107409, Antispam-Data: 2013.7.2.135124 X-ISUMailhub-test: Gauge=XIIIIIIIII, Probability=19%, Report=' RATWARE_RCVD_BONUS_SPC 2.0, HTML_70_90 0.1, SUPERLONG_LINE 0.05, BODYTEXTH_SIZE_10000_LESS 0, BODYTEXTP_SIZE_3000_LESS 0, BODY_SIZE_3000_3999 0, BODY_SIZE_5000_LESS 0, BODY_SIZE_7000_LESS 0, FROM_NAME_PHRASE 0, NO_URI_FOUND 0, RDNS_MSFT_PRIV 0, RDNS_NXDOMAIN 0, WEBMAIL_SOURCE 0, WEBMAIL_XOIP 0, WEBMAIL_X_IP_HDR 0, __CT 0, __CTYPE_HAS_BOUNDARY 0, __CTYPE_MULTIPART 0, __CTYPE_MULTIPART_ALT 0, __HAS_FROM 0, __HAS_HTML 0, __HAS_MSGID 0, __HAS_XOIP 0, __HTML_FONT_BLUE 0, __IMS_MSGID 0, __MIME_HTML 0, __MIME_VERSION 0, __SANE_MSGID 0, __STYLE_RATWARE_NEG 0, __SUBJ_ALPHA_END 0, __TAG_EXISTS_HTML 0, __TO_MALFORMED_2 0, __TO_NO_NAME 0' Reply-To: geda-help AT delorie DOT com --_000_D2FF84E1E2337A488420C56B924CA62C3A73E252ITSDAG2Ditsiast_ Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable Hi All, I have a requirement with splitting the bottom soldermask into two secti= ons. The bottom layer is a split ground plane with an area seeded with digi= tal components and the remainder seeded with a number of signal related via= s that are not grounded. The section containing digital components is to c= overed with the usual mask covering everywhere except the pads. The second= section is opposite, cover the via holes and expose all the copper plane. = Hence a negative of the usual soldermask. Does anyone know how to pull this off? I'm using PCB 20110918 on Fedora= 16. Thanks in advanced, RM --_000_D2FF84E1E2337A488420C56B924CA62C3A73E252ITSDAG2Ditsiast_ Content-Type: text/html; charset="us-ascii" Content-Transfer-Encoding: quoted-printable

Hi All,

I have a requirement with splitting the= bottom soldermask into two sections. The bottom layer is a split ground pl= ane with an area seeded with digital components and the remainder seeded wi= th a number of signal related vias that are not grounded. The section containing digital components is to covere= d with the usual mask covering everywhere except the pads. The second= section is opposite, cover the via holes and expose all the copper plane.&= nbsp; Hence a negative of the usual soldermask.

Does anyone know how to pull this off?&= nbsp; I’m using PCB 20110918 on Fedora 16.

Thanks in advanced, RM=

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