X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com X-Spam-Checker-Version: SpamAssassin 3.3.1 (2010-03-16) on ham01.websitewelcome.com X-Spam-Flag2999: NO X-Spam-Level2999: X-Spam-Status2999: "No, score=-1.9 required=5.0 tests=BAYES_00 autolearn=ham version=3.3.1 DomainKey-Signature: a=rsa-sha1; q=dns; c=nofws; s=default; d=gibibit.com; h=Received:Date:From:To:Subject:Message-ID:In-Reply-To:References:X-Mailer:Mime-Version:Content-Type:X-BWhitelist:X-Source:X-Source-Args:X-Source-Dir:X-Source-Sender:X-Source-Auth:X-Email-Count:X-Source-Cap; b=CZp0ZdZ7vHmnah++0HIGATy6Oaaq0KDRnhMjQ4VjgMPTxUhroyXJam5cYeHRzIa/QGImbO3/kia7YPDUc5D6Cr8Wclmftez7aDN+EJNQirhQC25yEPkjX+6FcdeqNLUy; Date: Wed, 8 Feb 2012 09:19:29 -0800 From: Colin D Bennett To: geda-help AT delorie DOT com Subject: Re: [geda-help] polygon shaped hole in solder mask Message-ID: <20120208091929.5159a6a5@svelte> In-Reply-To: <20120208071321.GA14573@geminiman> References: <20120208071321 DOT GA14573 AT geminiman> X-Mailer: Claws Mail 3.7.9 (GTK+ 2.24.6; x86_64-pc-linux-gnu) Mime-Version: 1.0 Content-Type: multipart/signed; micalg=PGP-SHA1; boundary="Sig_/FZ.lwkIYGl9vBlBM8Vn/HJN"; protocol="application/pgp-signature" X-AntiAbuse: This header was added to track abuse, please include it with any abuse report X-AntiAbuse: Primary Hostname - gator297.hostgator.com X-AntiAbuse: Original Domain - delorie.com X-AntiAbuse: Originator/Caller UID/GID - [47 12] / [47 12] X-AntiAbuse: Sender Address Domain - gibibit.com X-BWhitelist: no X-Source: X-Source-Args: X-Source-Dir: X-Source-Sender: c-67-185-118-84.hsd1.wa.comcast.net (svelte) [67.185.118.84]:41710 X-Source-Auth: colin AT gibibit DOT com X-Email-Count: 6 X-Source-Cap: c2t5bGVuO3NreWxlbjtnYXRvcjI5Ny5ob3N0Z2F0b3IuY29t Reply-To: geda-help AT delorie DOT com Errors-To: nobody AT delorie DOT com X-Mailing-List: geda-help AT delorie DOT com X-Unsubscribes-To: listserv AT delorie DOT com Precedence: bulk --Sig_/FZ.lwkIYGl9vBlBM8Vn/HJN Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: quoted-printable On Wed, 8 Feb 2012 01:13:21 -0600 mog wrote: > Hi I am trying to do something similar to this > http://www.commerce.com.tw/tlPic2002/12850340172204.jpg > I already have my logo in the component layer and have cleared > the area around it from my ground plain so it should be good > to go but I can't figure out how to remove the solder mask > from covering my polygon. Is this possible in pcb? How did you make your logo in the component layer? Is it made with polygons or with lines? Could you post a .pcb file with the logo? If it is made with lines, you could convert it to an element (thus converting the =E2=80=9Cline=E2=80=9D entities into =E2=80=9Cpad=E2=80=9D e= ntities) and then the pads will automatically clear the solder mask. If it is made with polygons, you are out of luck. I think. It's really too bad that pcb footprints are so restricted. Regards, Colin --Sig_/FZ.lwkIYGl9vBlBM8Vn/HJN Content-Type: application/pgp-signature; name=signature.asc Content-Disposition: attachment; filename=signature.asc -----BEGIN PGP SIGNATURE----- Version: GnuPG v1.4.11 (GNU/Linux) iEUEARECAAYFAk8yrqEACgkQokx8fzcGbYfYSgCaAhdYEtysxHfWotF3sYuoVUoQ CDcAlRzaVQqWu5FKCJc66Zs9+zXickQ= =Kux7 -----END PGP SIGNATURE----- --Sig_/FZ.lwkIYGl9vBlBM8Vn/HJN--