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X-Recipient:	geda-user AT delorie DOT com
Date:	Tue, 24 Oct 2017 09:00:04 +0200 (CEST)
X-X-Sender:	igor2 AT igor2priv
To:	geda-user AT delorie DOT com
X-Debug:	to=geda-user AT delorie DOT com from="gedau AT igor2 DOT repo DOT hu"
From:	gedau AT igor2 DOT repo DOT hu
Subject:	[geda-user] [pcb-rnd] padstack status and plans
Message-ID:	<alpine.DEB.2.00.1710240851210.27212@igor2priv>
User-Agent:	Alpine 2.00 (DEB 1167 2008-08-23)
MIME-Version:	1.0
Reply-To:	geda-user AT delorie DOT com

Hi all,

I started to work on padstacks and after a few days of hacking, the 
code foundation and concepts of the new feature is taking form.

Detailed user documentation of what pad stacks will be able to do: 
http://repo.hu/projects/pcb-rnd/user/02_model/index.html#padstack

Mid term plan: by the next release (end of this year) we should have fully 
working pad stacks, that:

- can replace vias

- most probably can do blind/buried vias

- can replace element pins as subcircuit light terminals

- can replace element pads as subcircuit light terminals

Long term plan: after we get this all tested out, we will start switching all 
our IO plugins over to use subcircuits instead of elements and padstacks 
instead of pins/pads/vias. We would start this in the next cycle (from 
January). The pace highly depends on user testing (thanks to the brave 
volunteers who sing up for using unstable features for production!). In the 
most optimistic scenario we finish this in 1..2 months, which means in one 
cycle, which means I could schedule element/pin/pad removal in the cycle 
following, around March.

(I had a more optimistic estimation on element removal earlier this year, 
but then I realized it is worth investing more time in testing before we 
do that.)

Regards,

Igor2

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