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Thu, 28 Jan 2016 10:19:52 -0800 (PST)
Date: Thu, 28 Jan 2016 19:19:43 +0100
From: "Nicklas Karlsson (nicklas DOT karlsson17 AT gmail DOT com) [via geda-user AT delorie DOT com]" <geda-user AT delorie DOT com>
To: geda-user AT delorie DOT com
Subject: Re: [geda-user] The nature of gEDA layers
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> >> I wouldn't include inter-layer connectivity as a layer. I think that's a
> >> fundamentally different idea. I would suggest implementing connectivity
> >> within a footprint/pattern/group as something like a netlist. 
> 
> The netlist defines the required connectivity.  The geometry implements
> the connectivity to match the netlist.

Correct.

> Connectivity calculations needs to be fast/efficient while working on a
> layout.  And it is a core concept of the program.

Perfect.

> The implemented connectivity is derived from the geometry, overlapping
> objects on conductive layers and overlapping objects between conductive
> and connected drill layer.  Some objects will be marked as pins, to
> match them to the netlist.

Overlapping objects between conductive layer is usually the plated ring on the board layer. As is now I think it is known plated via/pin connect all layers.

Objects marked as pins to match them to the netlist is perfect.

> > As is now plating flag solve connectivity problem. It is possible to
> > figure out the geometry of the plating between layers from the cut out
> > shape and plating flag. To include inter-layer connectivity as a layer
> > would however probably not be a good idea because of the problem
> > involved in working other direction.
> 
> I do not understand that. What other direction?

Geometry of plating between layers depnend on cut out shape which as is now is a drilled hole and it is no problem to figure out shape of plating on board layer. The other direction to draw cut out on board layer and plating between layer on separate layer with same mechanical position is not hard to implement but require drawing primitives on board and plating layer to agree.

> Why is the inter-layer connectivity a fundamentally different different
> idea?

Because drawing primitives added to the inter layer conectivity must match board cut out edges.

I think you think drilling of plated hole or plated cut out is the inter layer connectivity which in sort of is correct regarding connectivity. I think drilling is cut out at least on the board layer(s) and plating is adding of conductive material at same mechanical position as board layer.

That a drilled hole is a cut out at least in board layer(s) is no problem. I however think the most appropiate for most cases would be to derive connectivity between layer from the plated cut outs. This is close to what happens now then a plated via/pin is assumed to connect all layers although these connections do not end up as drawing primitives on a layer.

> Stephan


Nicklas Karlsson

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