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Date: | Mon, 30 Jun 2014 09:39:27 -0400 |
Message-ID: | <CAOuGh8_3kBAbcbK-dPHkct4V2M276x4gt=MY1ebxPQ-szgRA3g@mail.gmail.com> |
Subject: | Re: [geda-user] pcb: Patch for arcs with different radii for x and y |
on screen | |
From: | Bob Paddock <graceindustries AT gmail DOT com> |
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> Real-world blind and buried vias always connect a range of layers from N > to M. The tricky bit in my experience in large-layer-count boards was > always when there were multiple buried vias with the same X-Y > coordinate. In other words, something like layers 2-3 and 6-7 connected > in an 8-layer board. From a discussion I had with my board house years ago: "Per our discussion, here are hypothetical examples of pricing: 4 layer board, no blind or buried vias, price = X. 4 layer board, single blind vias (layers 1-2 or 3-4), price = X + 1/2-2/3X. 4 layer boars, single buried vias (layers 2-3), price = X + X. 4 layer board, double blind vias (layers 1-2 and 3-4) price X + X + 1/2X If blind vias overlap layers (say 1-3 and 3-4), we would have to no bid at this time, as laser (controlled depth) drilling would be required, and we do not have this process currently available."
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