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Date:	Sat, 20 Jul 2013 14:32:47 +1200
From:	Lilith Bryant <dark141 AT gmail DOT com>
Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
To:	geda-user AT delorie DOT com
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In-Reply-To:	<51E975F4.1070206@sonic.net> (from davecurtis@sonic.net on Sat
	Jul 20 05:23:00 2013)
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Reply-To:	geda-user AT delorie DOT com

No idea, it was negotiated as part of a production run.   As a contractor, 
I'm not party to that.

On 2013-07-20 05:23:00 AM, Dave Curtis wrote:
> On 07/18/2013 03:33 PM, Lilith Bryant wrote:
> > On 2013-07-19 01:19:25 AM, Rob Butts wrote:
> >> Has anyone done a PCB using the new chips with the BGA (ball grid 
> array)?
> >> If so, how did you define the footprint?  As through-holes?  Fab shops
> must
> >> be capable of accommodating these ICs otherwise they wouldn't exist.
> >>
> >> I'm thinking they must be easy to solder since it would simply fall into
> >> it's position with either pre-soldered holes or pre-soldered pins/balls.
> >>
> > I have just finished a paying job using an iMX6 processor (624 ball
> 0.8mm),
> > FPGA (256 ball 1mm), and 4xDDR3 (96 ball 0.8mm).    However, even for
> > personal use prototypes, I wouldn't even try doing it myself.
>
> What do you end up paying an assembly house to attach of those on a 
> one-off basis for a prototype?
> 
> 

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