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Message-ID:	<51E975F4.1070206@sonic.net>
Date:	Fri, 19 Jul 2013 10:23:00 -0700
From:	Dave Curtis <davecurtis AT sonic DOT net>
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To:	geda-user AT delorie DOT com
Subject:	Re: [geda-user] PCB BGA (ball grid array) Package/Footprint
References:	<1374186814 DOT 16840 DOT 19 AT zotlet>
In-Reply-To:	<1374186814.16840.19@zotlet>
Reply-To:	geda-user AT delorie DOT com

On 07/18/2013 03:33 PM, Lilith Bryant wrote:
> On 2013-07-19 01:19:25 AM, Rob Butts wrote:
>> Has anyone done a PCB using the new chips with the BGA (ball grid array)?
>> If so, how did you define the footprint?  As through-holes?  Fab shops must
>> be capable of accommodating these ICs otherwise they wouldn't exist.
>>
>> I'm thinking they must be easy to solder since it would simply fall into
>> it's position with either pre-soldered holes or pre-soldered pins/balls.
>>
> I have just finished a paying job using an iMX6 processor (624 ball 0.8mm),
> FPGA (256 ball 1mm), and 4xDDR3 (96 ball 0.8mm).    However, even for
> personal use prototypes, I wouldn't even try doing it myself.
What do you end up paying an assembly house to attach of those on a 
one-off basis for a prototype?

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